{"paper":{"title":"Thermal Management in Fine-Grained 3-D Integrated Circuits","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":[],"primary_cat":"cs.ET","authors_text":"Md Arif Iqbal, Mostafizur Rahman, Naveen Kumar Macha, Sehtab Hossain, Wafi Danesh","submitted_at":"2018-03-10T00:31:34Z","abstract_excerpt":"For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor increase hotspots and demand careful consideration of thermal management at all levels of integration [4] as stacked transistors are detached from the substrate (i.e., heat sink). Traditional system level approaches such as liquid cooling [5], heat spreader [6], etc. are inadequate for transistor level 3-D integration and have huge cost overhead [7]. In this paper"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"1803.03727","kind":"arxiv","version":1},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"}