{"record_type":"pith_number_record","schema_url":"https://pith.science/schemas/pith-number/v1.json","pith_number":"pith:2024:5LJ4JCR5QPBDG46CRPQ7LFROJT","short_pith_number":"pith:5LJ4JCR5","schema_version":"1.0","canonical_sha256":"ead3c48a3d83c23373c28be1f5962e4ccd08d8bcf75fb71c6b28ff99d657b084","source":{"kind":"arxiv","id":"2408.14655","version":2},"attestation_state":"computed","paper":{"title":"Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":["cond-mat.mtrl-sci","physics.app-ph"],"primary_cat":"cond-mat.supr-con","authors_text":"Achintya Paradkar, Fabian Resare, Karim Dakroury, Paul Nicaise, Witlef Wieczorek","submitted_at":"2024-08-26T21:41:45Z","abstract_excerpt":"Superconducting flip-chip interconnects are crucial for the three-dimensional integration of superconducting circuits in sensing and quantum technology applications. We demonstrate a simplified approach for a superconducting flip-chip device using commercially available indium microspheres and an in-house-built transfer stage for bonding two chips patterned with superconducting thin films. We use a gold-passivated niobium or niobium nitride layer as an under-bump metallization (UBM) layer between an aluminum-based superconducting wiring layer and the indium interconnect. At millikelvin tempera"},"verification_status":{"content_addressed":true,"pith_receipt":true,"author_attested":false,"weak_author_claims":0,"strong_author_claims":0,"externally_anchored":false,"storage_verified":false,"citation_signatures":0,"replication_records":0,"graph_snapshot":true,"references_resolved":false,"formal_links_present":false},"canonical_record":{"source":{"id":"2408.14655","kind":"arxiv","version":2},"metadata":{"license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","primary_cat":"cond-mat.supr-con","submitted_at":"2024-08-26T21:41:45Z","cross_cats_sorted":["cond-mat.mtrl-sci","physics.app-ph"],"title_canon_sha256":"2a62398c9ab6f636b443a2872a5893c50d4d5919acd551c4be27a7d7c9b8c604","abstract_canon_sha256":"812c22671597176391bd8fad30bcb2622f785b7749ac3282a7151c679af4da34"},"schema_version":"1.0"},"receipt":{"kind":"pith_receipt","key_id":"pith-v1-2026-05","algorithm":"ed25519","signed_at":"2026-07-05T10:02:51.130601Z","signature_b64":"bttyuoDzBSKrUcHr2JSJIPj3FzQlO7wXOtY6PG1HX4qA95//168CwsM02NYcV+XTvIT13ZkGCt7+F8BwqfdODA==","signed_message":"canonical_sha256_bytes","builder_version":"pith-number-builder-2026-05-17-v1","receipt_version":"0.3","canonical_sha256":"ead3c48a3d83c23373c28be1f5962e4ccd08d8bcf75fb71c6b28ff99d657b084","last_reissued_at":"2026-07-05T10:02:51.130156Z","signature_status":"signed_v1","first_computed_at":"2026-07-05T10:02:51.130156Z","public_key_fingerprint":"8d4b5ee74e4693bcd1df2446408b0d54"},"graph_snapshot":{"paper":{"title":"Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer","license":"http://arxiv.org/licenses/nonexclusive-distrib/1.0/","headline":"","cross_cats":["cond-mat.mtrl-sci","physics.app-ph"],"primary_cat":"cond-mat.supr-con","authors_text":"Achintya Paradkar, Fabian Resare, Karim Dakroury, Paul Nicaise, Witlef Wieczorek","submitted_at":"2024-08-26T21:41:45Z","abstract_excerpt":"Superconducting flip-chip interconnects are crucial for the three-dimensional integration of superconducting circuits in sensing and quantum technology applications. We demonstrate a simplified approach for a superconducting flip-chip device using commercially available indium microspheres and an in-house-built transfer stage for bonding two chips patterned with superconducting thin films. We use a gold-passivated niobium or niobium nitride layer as an under-bump metallization (UBM) layer between an aluminum-based superconducting wiring layer and the indium interconnect. At millikelvin tempera"},"claims":{"count":0,"items":[],"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"source":{"id":"2408.14655","kind":"arxiv","version":2},"verdict":{"id":null,"model_set":{},"created_at":null,"strongest_claim":"","one_line_summary":"","pipeline_version":null,"weakest_assumption":"","pith_extraction_headline":""},"integrity":{"clean":true,"summary":{"advisory":0,"critical":0,"by_detector":{},"informational":0},"endpoint":"/pith/2408.14655/integrity.json","findings":[],"available":true,"detectors_run":[],"snapshot_sha256":"c28c3603d3b5d939e8dc4c7e95fa8dfce3d595e45f758748cecf8e644a296938"},"references":{"count":0,"sample":[],"resolved_work":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57","internal_anchors":0},"formal_canon":{"evidence_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"author_claims":{"count":0,"strong_count":0,"snapshot_sha256":"258153158e38e3291e3d48162225fcdb2d5a3ed65a07baac614ab91432fd4f57"},"builder_version":"pith-number-builder-2026-05-17-v1"},"aliases":[{"alias_kind":"arxiv","alias_value":"2408.14655","created_at":"2026-07-05T10:02:51.130214+00:00"},{"alias_kind":"arxiv_version","alias_value":"2408.14655v2","created_at":"2026-07-05T10:02:51.130214+00:00"},{"alias_kind":"doi","alias_value":"10.48550/arxiv.2408.14655","created_at":"2026-07-05T10:02:51.130214+00:00"},{"alias_kind":"pith_short_12","alias_value":"5LJ4JCR5QPBD","created_at":"2026-07-05T10:02:51.130214+00:00"},{"alias_kind":"pith_short_16","alias_value":"5LJ4JCR5QPBDG46C","created_at":"2026-07-05T10:02:51.130214+00:00"},{"alias_kind":"pith_short_8","alias_value":"5LJ4JCR5","created_at":"2026-07-05T10:02:51.130214+00:00"}],"events":[],"event_summary":{},"paper_claims":[],"inbound_citations":{"count":0,"internal_anchor_count":0,"sample":[]},"formal_canon":{"evidence_count":0,"sample":[],"anchors":[]},"links":{"html":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT","json":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT.json","graph_json":"https://pith.science/api/pith-number/5LJ4JCR5QPBDG46CRPQ7LFROJT/graph.json","events_json":"https://pith.science/api/pith-number/5LJ4JCR5QPBDG46CRPQ7LFROJT/events.json","paper":"https://pith.science/paper/5LJ4JCR5"},"agent_actions":{"view_html":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT","download_json":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT.json","view_paper":"https://pith.science/paper/5LJ4JCR5","resolve_alias":"https://pith.science/api/pith-number/resolve?arxiv=2408.14655&json=true","fetch_graph":"https://pith.science/api/pith-number/5LJ4JCR5QPBDG46CRPQ7LFROJT/graph.json","fetch_events":"https://pith.science/api/pith-number/5LJ4JCR5QPBDG46CRPQ7LFROJT/events.json","actions":{"anchor_timestamp":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT/action/timestamp_anchor","attest_storage":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT/action/storage_attestation","attest_author":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT/action/author_attestation","sign_citation":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT/action/citation_signature","submit_replication":"https://pith.science/pith/5LJ4JCR5QPBDG46CRPQ7LFROJT/action/replication_record"}},"created_at":"2026-07-05T10:02:51.130214+00:00","updated_at":"2026-07-05T10:02:51.130214+00:00"}