Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links, observed 2026-05-22T23:57:47.020990Z
Paper Citation Record · LEDGER
As of 4 August 2026, this Paper Citation Record lists 40 of 40 outbound references and 2 inbound Pith citation observations for arXiv:2503.12946.
A citation records a reference. It does not transfer a finding from one paper to another.
Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links, observed 2026-05-22T23:57:47.020990Z
One-hop event checks from named stored sources.
Source: scholarly_work_events, retraction_status_cache, observed 2026-08-04T06:34:03.388597+00:00
Pith citing papers itemized under the disclosed page cap.
Source: paper_references, paper_reference_links, observed 2026-07-14T09:53:39.600659Z
A source-named dated measurement, never combined with another source.
Source: pith, observed 2026-05-10T09:28:39.200012Z
40 of 40 outbound references displayed
External citation measurements
No source-named external measurement is stored.
Observation ea058eb1-0ca9-4061-a8f4-e212c5fe5987 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation HotSpot
Reference 1
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 64cafaf7-cf69-49e5-b138-848bcd64c9bf · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation OpenRCX
Reference 2
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation c40f8de2-e0be-4b07-9679-aa968078a7d4 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation OpenSTA
Reference 3
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 1f7ab4fe-15ed-4185-8813-361bdcb63544 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation OpenROAD: Toward a self-driving, open-source digital layout implementation tool chain
Reference 4
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 93777e82-21be-4266-93a6-b4d8206e2aac · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Macro-3D: A physical design methodology for face-to-face-stacked heterogeneous 3D ICs
Reference 5
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 155cee2b-53fd-4b79-bcc9-05397e7af54c · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Cascade2D: A design-aware partitioning approach to mono- lithic 3D IC with 2D commercial tools
Reference 6
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation c0f444fd-a0fe-4dfe-bd79-899aaa8f467c · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Stronger mixed-size placement backbone considering second-order information
Reference 7
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 612a627a-b7dd-49c1-b2a5-f2f37afaa72c · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Die to wafer 3D stacking for below 10um pitch microbumps
Reference 8
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation cd5d2169-0f83-4a75-a511-4f4e2c71a336 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation From 2.5D to 3D chiplet systems: Investigation of thermal implications with HotSpot 7.0
Reference 9
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 5552e5e1-835c-4482-b348-8bd44ff0a83a · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation TSV-aware analytical placement for 3-D IC designs based on a novel weighted-average wirelength model
Reference 10
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 14149f16-40b6-4b6e-864f-64651ac34f8c · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation 2023 ICCAD CAD contest problem B: 3D placement with macros
Reference 11
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 5ba1e3a9-f6e3-4e6a-a4a4-d06f727bd85f · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation 2022 ICCAD CAD contest problem B: 3D placement with D2D vertical connections
Reference 12
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation c87b0ab8-fde4-4333-9c26-b37826f539cd · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Hier-RTLMP: A hier- archical automatic macro placer for large-scale complex IP blocks
Reference 13
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 8494480c-2f26-42dd-b842-a1b386ea0983 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation TritonRoute: The open-source detailed router
Reference 14
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 64757567-5dd3-48fc-9686-042cab12ccf4 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation TA3D: Timing- aware 3D IC partitioning and placement by optimizing the critical path
Reference 15
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 3f62d5e0-1766-4f8a-b84e-637be7d7e809 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Micro- bumping, hybrid bonding, or monolithic? A PPA study for heterogeneous 3D IC options
Reference 16
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 0eea5871-76aa-4d5b-92b3-3d674ac82b0d · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Compact-2D: A physical design methodology to build commercial-quality face-to-face-bonded 3D ICs
Reference 17
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 3528f5ff-9328-42fb-b70e-b1289c5b896d · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Analytical die-to-die 3-D placement with bistratal wirelength model and GPU acceleration
Reference 18
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation d40e52ef-ae05-4438-8cfe-0a982a2299f7 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation DREAM- Place: Deep learning toolkit-enabled GPU acceleration for modern VLSI placement
Reference 19
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 5d92c640-78bf-409f-9619-588913c8e140 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Routing- aware legal hybrid bonding terminal assignment for 3D face-to-face stacked ICs
Reference 20
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 6d8d8c91-ea2f-4e6c-9c8e-5e4a8f1f23cd · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation ePlace-3D: Electrostatics based placement for 3D-ICs
Reference 21
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation b448e0ae-f322-4d73-b601-c66362ab2aa9 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Cramming more components onto integrated circuits
Reference 22
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 77de8e96-16ae-41db-b5df-d7c01b05645a · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Art- 3D: Analytical 3D placement with reinforced parameter tuning for monolithic 3D ICs
Reference 23
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation cbb36b51-7295-44ef-9e25-dbc93c66389b · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation FastRoute: A step to integrate global routing into placement
Reference 24
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 380110db-bad6-4725-8592-79060fdb724f · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Shrunk-2-D: A physical design methodology to build commercial-quality monolithic 3-D ICs
Reference 25
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 763fe14d-4195-4e37-b229-dcb8a6950e71 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Pin-3D: A physical synthesis and post-layout optimization flow for heterogeneous monolithic 3D ICs
Reference 26
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 812feb50-1b3f-4358-9f5c-f7cab325488a · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation In- creMacro: Incremental macro placement refinement
Reference 27
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation b2bfe1da-7e39-4659-8556-a809374dd363 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Nangate technology node
Reference 28
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 1cf97200-ed1a-4a53-b348-3f8c81af314b · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Timing-driven global placement by efficient critical path extraction
Reference 29
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 686b5c3e-d1bb-4e1b-9b1e-162bc8504997 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Snap-3D: A constrained placement-driven physical design methodology for face-to-face-bonded 3D ICs
Reference 30
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 2d6fb4de-6de2-48bc-8270-43e6f2b0c1ed · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation ATPlace2.5D: Analytical thermal-aware chiplet placement framework for large-scale 2.5D-IC
Reference 31
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation d1e099fe-9ee9-4b0d-b9ba-58465a5c53b5 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Benchmarking end-to-end performance of AI- based chip placement algorithms
Reference 32
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 8696ce0e-ec94-490b-bee9-a67c72ee64ca · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation A skyline heuristic for the 2D rectangular packing and strip packing problems
Reference 33
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation a366e1a3-d1e6-4a3f-8bd9-abbfe036e0de · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Unresolved cited work
Reference 34
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation c9382728-b641-43a9-8507-3280f3f36b55 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Reinforcement learning policy as macro regulator rather than macro placer
Reference 35
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation e717d831-63da-48c8-860e-5ab38e15dd32 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Standard cells do matter: Uncovering hidden connections for high-quality macro placement
Reference 36
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 56503287-1aec-4f77-8313-f305e54b1268 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Physical design for advanced 3D ICs: Challenges and solutions
Reference 37
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation fa612c15-d27b-414d-8ae4-0d8e6d6c5798 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Analytical het- erogeneous die-to-die 3-D placement with macros
Reference 38
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation 8cd18167-c078-40bb-ab74-f2077c482e8f · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation Unresolved cited work
Reference 39
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation a6cbfc92-4a69-48c9-a814-f873eecd0464 · outbound
Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation High-performance logic-on-memory monolithic 3-D IC designs for Arm Cortex-A processors
Reference 40
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation fa145195-8b2d-4404-90c7-51f48f6fb0ee · inbound
A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation
Reference 23
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-04T06:34:03.388597+00:00.
Observation d891ceb8-39a2-4063-a620-112ef235226b · inbound
Rectilinear Matching to the Integer Grid in Nearly-Linear Time Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation
Reference 11
Source-reported events for the cited work
Unavailable: canonical work link unavailable.