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High-fidelity dispersive spin sensing in a tuneable unit cell of silicon MOS quantum dots
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Metal-oxide-semiconductor (MOS) technology is a promising platform for developing quantum computers based on spin qubits. Scaling this approach will benefit from compact and sensitive sensors that minimize constraints on qubit connectivity while being industrially manufacturable. Here, we demonstrate a compact dispersive spin-qubit sensor, a single-electron box (SEB), within a bilinear unit cell of planar MOS quantum dots (QDs) fabricated using an industrial grade 300 mm wafer process. By independent gate control of the SEB and double-quantum-dot tunnel rates, we optimize the sensor to achieve a readout fidelity of 99.92% in 340us (99% in 20us), fidelity values on a par with the best obtained with less compact sensors. Furthermore, we develop a Hidden Markov Model of the two-electron spin dynamics that enables a more accurate calculation of the measurement outcome and hence readout fidelity. Our results show how high-fidelity sensors can be introduced within silicon spin-qubit architectures while maintaining sufficient qubit connectivity as well as providing faster readout and more efficient initialisation schemes.
Forward citations
Cited by 2 Pith papers
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Four-state discrimination for a pair of spin qubits via gate reflectometry
Single-shot gate-reflectometry readout can discriminate all four spin states of a two-electron double quantum dot by tuning detuning and tunnel coupling to maximize quantum-capacitance contrast.
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Electron shuttling as a probe for charge defects
A shuttled electron's spin-dephasing pattern as a function of shuttle distance reveals the position and dynamics of individual charge defects in silicon.
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