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M Tanjidur Rahman

Identifiers

  • name variant M Tanjidur Rahman 0.60 · backfill

Papers (2)

  1. In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance eess.IV · 2023 · author #3
  2. Defense-in-Depth: A Recipe for Logic Locking to Prevail cs.CR · 2019 · author #1

Mentions

  • 2307.13118 #3 · arxiv_oai · confidence 0.70 M Tanjidur Rahman
  • 1907.08863 #1 · arxiv_oai · confidence 0.70 M Tanjidur Rahman

Frequent Coauthors