\'E. Kun

Identifiers

• name variant \'E. Kun 0.60 · backfill

Papers (1)

1. Nanoscale characterization of thin immersion silver coatings on copper substrates cond-mat.mtrl-sci · 2015 · author #8

Mentions

• 1502.01579 #8 · backfill · confidence 0.70 \'E. Kun

Frequent Coauthors

• A. Csik 1 shared papers
• D. S\'os 1 shared papers
• J. Hakl 1 shared papers
• J. T\'oth 1 shared papers
• K. Vad 1 shared papers
• L. K\"ov\'er 1 shared papers
• S. M\'esz\'aros 1 shared papers
• T.I. T\"or\"ok 1 shared papers