Max O. Bloomfield

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Papers (1)

1. Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack cs.CE · 2026 · author #2

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Frequent Coauthors

• Jacob S. Merson 1 shared papers
• Mohammad Elahi 1 shared papers
• Theodorian Borca-Tasciuc 1 shared papers