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Z. Pagel

Identifiers

  • name variant Z. Pagel 0.60 · backfill

Papers (1)

  1. Thermocompression Bonding Technology for Multilayer Superconducting Quantum Circuits physics.app-ph · 2017 · author #3

Mentions

  • 1705.02435 #3 · arxiv_oai · confidence 0.70 Z. Pagel

Frequent Coauthors