Karim Dakroury

Identifiers

• name variant Karim Dakroury 0.60 · backfill

Papers (1)

1. Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer cond-mat.supr-con · 2024 · author #3

Mentions

• 2408.14655 #3 · arxiv_oai · confidence 0.70 Karim Dakroury

Frequent Coauthors

• Achintya Paradkar 1 shared papers
• Fabian Resare 1 shared papers
• Paul Nicaise 1 shared papers
• Witlef Wieczorek 1 shared papers