Daniel J. Coady

Identifiers

• name variant Daniel J. Coady 0.60 · backfill

Papers (1)

1. Sub 20 nm Silicon Patterning and Metal Lift-Off Using Thermal Scanning Probe Lithography cond-mat.mtrl-sci · 2014 · author #5

Mentions

• 1411.4833 #5 · arxiv_oai · confidence 0.70 Daniel J. Coady

Frequent Coauthors

• Armin W. Knoll 1 shared papers
• Colin Rawlings 1 shared papers
• Heiko Wolf 1 shared papers
• James L. Hedrick 1 shared papers
• Philipp Mensch 1 shared papers
• Urs Duerig 1 shared papers