EMSpice 3 delivers the first integrated full-chip EM-IR analysis tool that couples Joule heating with practical spatial thermal profiles, uses a rational Krylov solver for speed, and shows that temperature distribution matters more for lifetime than average temperature alone.
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations
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EMSpice 3: Full-chip Temperature-Aware Multiphysics Electromigration and IR-Drop Analysis
EMSpice 3 delivers the first integrated full-chip EM-IR analysis tool that couples Joule heating with practical spatial thermal profiles, uses a rational Krylov solver for speed, and shows that temperature distribution matters more for lifetime than average temperature alone.