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iEDA: An Open-Source Intelligent Physical Implementation Toolkit and Library

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arxiv 2308.01857 v1 pith:BBD3GAXE submitted 2023-08-03 cs.AR

Xingquan Li , Simin Tao , Zengrong Huang , Shijian Chen , Zhisheng Zeng , Liwei Ni , Zhipeng Huang , Chunan Zhuang
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Hongxi Wu Weiguo Li1 Xueyan Zhao He Liu Shuaiying Long Wei He Bojun Liu Sifeng Gan Zihao Yu Tong Liu Yuchi Miao Zhiyuan Yan Hao Wang Jie Zhao Yifan Li Ruizhi Liu Xiaoze Lin Bo Yang Zhen Xue Fuxing Huang Zonglin Yang Zhenggang Wu Jiangkao Li Yuezuo Liu Ming Peng Yihang Qiu Wenrui Wu Zheqing Shao Kai Mo Jikang Liu Yuyao Liang Mingzhe Zhang Zhuang Ma Xiang Cong Daxiang Huang Guojie Luo Huawei Li Haihua Shen Mingyu Chen Dongbo Bu Wenxing Zhu Ye Cai Xiaoming Xiong Ying Jiang Yi Heng Peng Zhang Biwei Xie Yungang Bao
This is my paper · ORCID
classification cs.AR
keywords iedaanalysisopen-sourcedesigndifferentphysicalprojecttiming
verification ladder T0 review T1 audit T2 compute T3 formal
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Open-source EDA shows promising potential in unleashing EDA innovation and lowering the cost of chip design. This paper presents an open-source EDA project, iEDA, aiming for building a basic infrastructure for EDA technology evolution and closing the industrial-academic gap in the EDA area. iEDA now covers the whole flow of physical design (including Floorplan, Placement, CTS, Routing, Timing Optimization etc.), and part of the analysis tools (Static Timing Analysis and Power Analysis). To demonstrate the effectiveness of iEDA, we implement and tape out three chips of different scales (from 700k to 1.5M gates) on different process nodes (110nm and 28nm) with iEDA. iEDA is publicly available from the project home page http://ieda.oscc.cc.

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  1. CHIA: An open-source framework for principled, agentic AI-driven hardware/software co-design research

    cs.AR 2026-06 unverdicted novelty 7.0 of 10

    CHIA is an open-source framework for agentic AI-driven hardware/software co-design using CHIA loops as directed cyclic graphs, a tool library, and features for reliable experimentation, shown via five case studies.

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