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REVIEW 4 major objections 5 minor 77 references

DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates

T0 review · 4 major / 5 minor · reviewed 2026-08-06 · deepseek-v4-flash

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Pith's one-line read The paper claims a complete pipeline—design, print, assemble, dissolve, reuse—can make circuit boards that are fully recyclable and functionally comparable to standard FR-4 boards.

desk verdict The fabrication pipeline is real and well-demonstrated; the sustainability headline outruns the LCA data. read the letter →

arxiv 2507.22193 v1 pith:WFKBND4G submitted 2025-07-29 cs.HC

Zeyu Yan , SuHwan Hong , Josiah Hester , Tingyu Cheng , Huaishu Peng This is my paper · ORCID
classification cs.HC
keywords PCBrecyclingliquidmetalEGaInPVAsubstrateFDM3Dprintingsustainableelectronicse-wastelifecycleassessment
verification ladder T0 review T1 audit T2 compute T3 formal

The pith

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The reading

DissolvPCB sets out to prove that an entire printed circuit board assembly—substrate, conductor, and components—can be designed, made, used, and then recycled back into raw materials with no soldering and no harsh chemicals. The recipe is a 3D-printed polyvinyl alcohol (PVA) substrate with hollow channels that are injected with eutectic gallium–indium (EGaIn) liquid metal; components sit in printed sockets sealed with PVA glue. Because PVA dissolves in water and EGaIn re-coalesces into a bead, dropping the finished board into water separates all three material streams for reuse. The paper backs this with characterization data, a KiCad-to-printable-substrate plugin, three working prototypes, and a life-cycle assessment reporting order-of-magnitude environmental reductions versus a CNC-milled FR-4 board. The broader point is that e-waste from prototyping could be handled locally and cyclically instead of shipped to centralized recyclers.

What carries the argument

The load-bearing combination is PVA plus EGaIn: PVA is a water-soluble thermoplastic that an unmodified FDM printer can extrude into a channeled substrate, and EGaIn is a room-temperature liquid metal whose surface tension forms a conductive meniscus at channel openings and whose droplet re-forms in water. The substrate is a network of hollow 0.7 mm channels (traces), sealed sockets sized to component footprints, and PVA glue applied at component seams as a solder analog. A FreeCAD plugin parses KiCad .kicad_pcb files, turns trace segments into channel geometry, inserts sockets from a 3D model library, and subtracts everything from the board body in one Boolean operation, which is what lowers the barrier from hand-built 3D models to standard PCB designs.

What would settle it

Recompute the LCA with a genuine PVA production inventory instead of the PVC proxy; if global-warming, resource-depletion, and acidification potentials rise toward the FR-4 baseline, the order-of-magnitude environmental claims collapse. A second check: build a fresh board from recovered filament and recovered EGaIn and measure trace resistance against the reported 0.03 $\Omega$ per 30 mm to confirm the recycling loop actually closes.

Watch

Extended reading notes

Core claim

The paper's central claim is that a PCBA built from a 3D-printed PVA dielectric and EGaIn conductors is functionally comparable to a traditional FR-4 board yet fully recyclable: immersion in water dissolves the substrate, the liquid metal reforms into a droplet, and the unsoldered components are recovered intact. Recovery is demonstrated at 98.6–99.4% of the PVA and 97.7–99.0% of the EGaIn across three prototypes, and the recovered PVA was re-extruded into filament and used to print a new functioning board. Electrically, 0.7 mm by 0.7 mm EGaIn-filled traces measured about 0.03 $\Omega$ per 30 mm (versus about 0.02 $\Omega$ for 1 oz copper at the same width), sustained 5 A loads with surface temperatures plateauing near 51 °C, and passed 100 Hz–10 MHz waveforms without visible attenuation. The comparison LCA reports reductions of roughly one order of magnitude in global-warming, resource-depletion, and acidification impacts relative to a CNC-milled FR-4 board, with the explicit caveat that PVA production data were substituted with PVC.

Load-bearing premise

The environmental-impact claim rests on the assumption that polyvinyl chloride (PVC) production data are a fair stand-in for polyvinyl alcohol (PVA) in the life-cycle database; if real PVA production is substantially more polluting than PVC, the reported order-of-magnitude reductions do not follow.

Editorial extensions

If this is right

  • Adopting the workflow means a maker can move from a KiCad layout to a functioning, double-sided circuit on a stock FDM printer, then recover the substrate, conductor, and components by dissolving the board in water.
  • The measured 5 A current capacity and 10 MHz signaling cover a substantial fraction of hobbyist and research prototyping loads, so the method is a practical alternative to FR-4 for that range, not just a material demonstration.
  • Because the substrate is printed rather than laminated, the same pipeline extends to single-piece 3D circuit topologies (the fidget cube) and Joule-heated 4D shape change (the gripper) that flat FR-4 cannot produce.
  • If the LCA survives scrutiny, substituting this process for CNC-milled FR-4 in prototyping cuts global-warming, resource-depletion, and acidification impacts by roughly an order of magnitude per board.

Reading between the lines

Editorial extensions of the paper, not claims the author makes directly.

  • The paper does not test how PVA filament and EGaIn survive repeated recycling cycles; whether the loop stays circular over several generations, including any buildup of contaminants from recovered components, is an open question the authors leave implicit.
  • Since the plugin handles only flat multi-layer boards, the 3D and 4D examples required manual CAD routing; an automated 3D-routing EDA pass would make those form factors as accessible as the flat ones.
  • The environmental comparison would be more decisive if re-run with a true PVA production inventory, since the PVC proxy is the one unverified input in the LCA.
  • The mechanism is general: any water-soluble thermoplastic substrate paired with a low-melting conductive alloy should reproduce the dissolve-and-recover behavior, so PVA plus EGaIn is one instance of a broader design space the paper does not explore.
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Signed reviews

No signed human review yet.

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, and a circularity audit.

Referee Report

4 major / 5 minor

Summary. This paper presents DissolvPCB, an end-to-end prototyping workflow for recyclable PCBAs built from FDM-printed PVA substrates with EGaIn-filled channels. The manuscript describes fabrication and water-based recycling, characterizes printable channel dimensions, insulation thickness, DC conductivity/current capacity, and high-frequency waveform delivery, introduces a FreeCAD plugin that converts KiCad PCB files into printable substrate models, conducts a cradle-to-grave LCA comparing a small circuit with a CNC-milled FR-4 counterpart, and demonstrates three prototypes (Bluetooth speaker, fidget device, Joule-heated gripper) with reported material recovery rates. The central claim is that DissolvPCB is the first pipeline for reliable, fully recyclable PCBAs functionally comparable to FR-4 boards.

Significance. The paper's strengths are concrete: working prototypes, an open-source conversion tool, measured recovery percentages, reproducible fabrication parameters, and candid discussion of limitations in Section 8. If the LCA claim is adequately supported, the work would make a meaningful contribution to sustainable making by combining prior materials (PVA, EGaIn) into an integrated and accessible pipeline. The fabrication core is credible, but the environmental-impact headline currently rests on an unvalidated data substitution; the paper also under-reports sample sizes in insulation and high-frequency tests. These issues are fixable with sensitivity analysis and additional quantitative reporting, rather than being fundamental flaws in the fabrication approach.

major comments (4)
  1. [Section 6.1 and Abstract] The LCA substitutes PVC for PVA in ecoinvent v3.10 because PVA is unavailable, and the abstract and Section 6.3 claim reductions in ADP, AP, and GWP by approximately one order of magnitude. PVA and PVC have very different production routes, so the substitution is not validated. Please rerun the LCA with an actual PVA inventory or, at minimum, add a sensitivity analysis that bounds the PVA production and disposal impacts. Without this, the order-of-magnitude environmental claim in the abstract is not established, even though the fabrication-side contributions are credible.
  2. [Section 4.3] The minimum insulation thickness of 0.15 mm is supported only by the statement that no short circuits were observed 'across multiple samples,' without reporting the number of samples, the number of trace pairs tested, or the test conditions. This value feeds the DRC rules in Section 5.1 and underlies the reliability claim in Section 8. Please report the sample size and, ideally, a pass/fail rate or a statistical bound for the insulation tests.
  3. [Section 4.5] The claim that DissolvPCB 'supports high-frequency signal transmission... up to 10 MHz without significant signal loss or distortion' is based on visual comparison of input and output waveforms in Figure 10. No measured insertion loss, amplitude ratio, edge-rate data, or sample count is reported. Please provide quantitative waveform measurements (e.g., output/input amplitude versus frequency, or S-parameter data for representative traces) or weaken the claim to match the qualitative evidence.
  4. [Section 3.2 and Section 7] The manuscript states that recovered electronic components and EGaIn are ready for reuse, and the abstract describes the loop as 'fully recyclable.' However, the only demonstrated downstream use is recovered PVA re-extruded into filament (Section 4, motor driver example). No functional test is reported for reclaimed components or for the electrical conductivity of EGaIn after NaOH deoxidation and reformation. Please add functionality checks, or explicitly limit the recyclability claim to material recovery rather than closed-loop electronic reuse.
minor comments (5)
  1. [Title and Section 4.4] The title and several headers use inconsistent spacing ('PV A'); Section 4.4 contains a typo ('a across-section'). Please correct these and run a spelling pass.
  2. [Section 3.1.3 and Appendix A.1] The EGaIn composition is given as 75.5% gallium and 24.5% indium in Section 3.1.3, but Appendix A.1 states a 3:1 ratio by weight. Please reconcile these values.
  3. [Figure 10] The waveform figures would be easier to interpret with axis labels, an input/output overlay legend, and a printed amplitude difference; the current presentation is purely qualitative.
  4. [Section 6.3] The LCA credits recycling benefits in Figure 12b, but the allocation rule between the current product life and the next use is not documented. Please state the allocation method or explain how benefits are credited.
  5. [Section 8.1] The comparison of 15 mil FR-4 trace width to the 0.7 mm DissolvPCB channel width should be checked, since 15 mil is approximately 0.38 mm, which is not exactly half of 0.7 mm.

Circularity Check

0 steps flagged · score 0.0 of 10

No significant circularity: the paper's fabrication, characterization, recovery, and software claims are supported by in-paper measurements and disclosed data assumptions, not by self-referential derivation.

full rationale

The paper does not derive any predicted quantity from a fitted parameter. Trace conductivity, current capacity, waveform delivery, recovery rates, and prototype function are direct measurements reported in Sections 4 and 7. The FreeCAD plugin converts KiCad files into 3D models by geometric parsing and Boolean operations (Section 5.2); the output model is a rendering of the input layout subject to stated design rule constraints, not a prediction statistically forced by a fit. The LCA in Section 6.1 uses PVC inventory as a substitute for PVA, and this is disclosed in the text: "Due to the unavailability of PVA in the database, we substituted it with PVC (Polyvinyl Chloride)." This is a data-availability assumption that may affect the magnitude of the environmental comparison, but it is not circular: the DissolvPCB-side inventory is specified independently (Section 6.2), and the comparison is computed with ecoinvent and CML rather than calibrated to the conclusion. Self-citations to prior PCB-recycling work, such as SolderlessPCB and PCB Renewal, are contextual background in Sections 1 and 2 and are not used to justify any load-bearing inference in the present derivation chain. The central claims rest on in-paper experiments and measurements; no fitted input is renamed as a prediction, and no uniqueness result or ansatz is imported via self-citation.

Assumptions & free parameters 5 free parameters · 4 assumptions · 0 invented entities

The core fabrication result is measured rather than derived, but the LCA and performance claims depend on several unverified assumptions: PVC as a stand-in for PVA, prior-literature EGaIn resistivity, component survivability after water recycling, and a comparison scenario whose FR-4 end-of-life is not detailed.

free parameters (5)
  • PVA glue formulation ratio = 3:5 PVA pellets to water by weight
    Chosen empirically (Section 3.1.4) to minimize substrate dissolution while providing adhesive strength; not derived from a model.
  • Print speed and retraction distance = 30 mm/s, 10 mm retraction
    Empirically set (Section 3.1.2) to prevent stringing and channel blockage in PVA printing.
  • Minimum printable channel cross-section = 0.7 x 0.7 mm with 0.2 mm nozzle; 0.9 x 0.9 mm with 0.4 mm nozzle
    Determined by EGaIn injection trials (Section 4.2); sets the trace width limit and board footprint.
  • Minimum insulation wall thickness = 0.15 mm in-plane; 0.18 mm vertical
    Minimum values with no observed short circuits in the reported samples (Section 4.3); adopted into DRC rules.
  • NaOH deoxidation concentration = 2 mol/L
    Applied at droplet scale to deoxidize recovered EGaIn (Section 3.2.2); no titration or sensitivity data provided.
assumptions (4)
  • ad hoc to paper ecoinvent v3.10 PVC inventory approximates PVA production and disposal impacts
    Section 6.1 substitutes PVC for PVA because PVA is unavailable in the database; no chemical or energy justification is given.
  • domain assumption EGaIn material properties from prior literature are accurate for the prepared alloy
    Section 4.4 cites Dickey et al. 2008 for EGaIn volume resistivity of 29 microOhm cm instead of measuring the lab-prepared alloy.
  • domain assumption Recovered electronic components remain functional after water immersion, drying, and NaOH exposure
    Section 3.2.2 says components are ready for reuse after drying, but no systematic before/after electrical test is reported.
  • domain assumption The selected LCA scenarios fairly compare DissolvPCB with in-lab recycling to FR-4 with conventional end-of-life
    Section 6.3 attributes most of the impact difference to FR-4 non-recyclability, yet the FR-4 end-of-life details are not described.

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Cite this review

Pith. "Pith review of DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates." pith.science (2026). https://pith.science/paper/WFKBND4G

@misc{pith2026250722193,
  author       = {Pith},
  title        = {Pith review of: DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates},
  year         = {2026},
  howpublished = {\url{https://pith.science/paper/WFKBND4G}},
  note         = {Machine review of arXiv:2507.22193}
}
read the original abstract

We introduce DissolvPCB, an electronic prototyping technique for fabricating fully recyclable printed circuit board assemblies (PCBAs) using affordable FDM 3D printing, with polyvinyl alcohol (PVA) as a water-soluble substrate and eutectic gallium-indium (EGaIn) as the conductive material. When obsolete, the PCBA can be easily recycled by immersing it in water: the PVA dissolves, the EGaIn re-forms into a liquid metal bead, and the electronic components are recovered. These materials can then be reused to fabricate a new PCBA. We present the DissolvPCB workflow, characterize its design parameters, evaluate the performance of circuits produced with it, and quantify its environmental impact through a lifecycle assessment (LCA) comparing it to conventional CNC-milled FR-4 boards. We further develop a software plugin that automatically converts PCB design files into 3D-printable circuit substrate models. To demonstrate the capabilities of DissolvPCB, we fabricate and recycle three functional prototypes: a Bluetooth speaker featuring a double-sided PCB, a finger fidget toy with a 3D circuit topology, and a shape-changing gripper enabled by Joule-heat-driven 4D printing. The paper concludes with a discussion of current technical limitations and opportunities for future directions.

Figures

Figures reproduced from arXiv: 2507.22193 by the authors.

Figure 1
Figure 1. A magnetic field detector circuit made using [PITH_FULL_IMAGE:figures/full_fig_p001_1.png] view at source ↗
Figure 2
Figure 2. Overview of the magnetic field detector circuit: a) [PITH_FULL_IMAGE:figures/full_fig_p004_2.png] view at source ↗
Figure 3
Figure 3. Fabrication and recycling process of DissolvPCB: a) 3D printing the circuit substrate; b) injecting EGaIn; c) placing components into their corresponding sockets; d) fixing components and sealing the EGaIn channel openings using PVA adhesive; e) completed and functional DissolvPCB circuit; f) the example circuit dissolving in water; g) separated elements after dissolving, including PVA solution, EGaIn, and electroni… view at source ↗
Figures from the paper (13 more)
Figure 4
Figure 4. Figure 4: PVA re-extrusion and reuse: a) a shredder used for [PITH_FULL_IMAGE:figures/full_fig_p006_4.png]
Figure 5
Figure 5. Figure 5: Socket designs for components: a) THT; b) SMD [PITH_FULL_IMAGE:figures/full_fig_p006_5.png]
Figure 6
Figure 6. Figure 6: Trace dimension experiment sample and its internal [PITH_FULL_IMAGE:figures/full_fig_p007_6.png]
Figure 9
Figure 9. Figure 9: Trace conductivity and current capacity test sample: [PITH_FULL_IMAGE:figures/full_fig_p008_9.png]
Figure 8
Figure 8. Figure 8: Trace Z-direction insulation test sample, with an [PITH_FULL_IMAGE:figures/full_fig_p008_8.png]
Figure 10
Figure 10. Figure 10: Waveform delivery test sample: a) test setup con [PITH_FULL_IMAGE:figures/full_fig_p009_10.png]
Figure 11
Figure 11. Figure 11: Screenshots of the FreeCAD plugin generating a [PITH_FULL_IMAGE:figures/full_fig_p009_11.png]
Figure 12
Figure 12. Figure 12: Life cycle assessment: a) life cycle system inven [PITH_FULL_IMAGE:figures/full_fig_p010_12.png]
Figure 13
Figure 13. Figure 13: Bluetooth Speaker: a) KiCad design of the speaker [PITH_FULL_IMAGE:figures/full_fig_p011_13.png]
Figure 14
Figure 14. Figure 14: Electronic Fidget: a) the KiCad PCB design used [PITH_FULL_IMAGE:figures/full_fig_p012_14.png]
Figure 15
Figure 15. Figure 15: Three-finger gripper: a) gripper design with ex [PITH_FULL_IMAGE:figures/full_fig_p012_15.png]
Figure 16
Figure 16. Figure 16: Recommended equipment and preparation of [PITH_FULL_IMAGE:figures/full_fig_p016_16.png]
Figure 17
Figure 17. Figure 17: Processing PVA solution: a) filtering the recov [PITH_FULL_IMAGE:figures/full_fig_p017_17.png]

Discussion (0). Continue with ORCID to comment.

Reference graph

Works this paper leans on

77 extracted references · 48 canonical work pages

  1. [1]

    Vicente Arroyos, Maria L K Viitaniemi, Nicholas Keehn, Vaidehi Oruganti, Win- ston Saunders, Karin Strauss, Vikram Iyer, and Bichlien H Nguyen. 2022. A Tale of Two Mice: Sustainable Electronics Design and Prototyping. InExtended Abstracts of the 2022 CHI Conference on Human Factors in Computing Systems (New Orleans, LA, USA) (CHI EA ’22). Association for ...

    arXiv 2022

  2. [2]

    Cornelis P. Baldé, Ruediger Kuehr, Tales Yamamoto, Rosie McDonald, Elena D’Angelo, Shahana Althaf, Garam Bel, Otmar Deubzer, Elena Fernandez-Cubillo, Vanessa Forti, Vanessa Gray, Sunil Herat, Shunichi Honda, Giulia Iattoni, Deepali S. Khetriwal, Vittoria Luda di Cortemiglia, Yuliya Lobuntsova, Innocent Nnorom, Noémie Pralat, and Michelle Wagner. 2024. Glo...

    work page 2024

  3. [3]

    Fiona Bell, Latifa Al Naimi, Ella McQuaid, and Mirela Alistar. 2022. Designing with Alganyl. In Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction (Daejeon, Republic of Korea) (TEI ’22) . Association for Computing Machinery, New York, NY, USA, Article 2, 14 pages. https://doi.org/ 10.1145/3490149.3501308

    work page arXiv 2022

  4. [4]

    Fiona Bell, Derrek Chow, Hyelin Choi, and Mirela Alistar. 2023. SCOBY BREAST- PLATE: SLOWLY GROWING A MICROBIAL INTERFACE. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Inter- action (Warsaw, Poland) (TEI ’23). Association for Computing Machinery, New York, NY, USA, Article 34, 15 pages. https://doi.org/10....

    work page arXiv 2023

  5. [5]

    Bharath, Puttegowda Madhu, Thyavihalli G

    Kurki N. Bharath, Puttegowda Madhu, Thyavihalli G. Y. Gowda, Akarsh Verma, Mavinkere R. Sanjay, and Suchart Siengchin. 2020. A novel approach for develop- ment of printed circuit board from biofiber based composites.Polymer Composites 41, 11 (2020), 4550–4558. https://doi.org/10.1002/pc.25732

    work page doi:10.1002/pc.25732 2020

  6. [6]

    Biswal, Peter Hong, Zhihan Zhang, Yiwen Zheng, Surabhit Gupta, Dhriti Nepal, Vikram Iyer, and Aniruddh Vashisth

    Agni K. Biswal, Peter Hong, Zhihan Zhang, Yiwen Zheng, Surabhit Gupta, Dhriti Nepal, Vikram Iyer, and Aniruddh Vashisth. 2025. Flexible and Stretchable Vitrimers for Sustainable Electronics. ACS Applied Materials & Interfaces 17, 6 (2025), 9736–9747. https://doi.org/10.1021/acsami.4c16995

    work page doi:10.1021/acsami.4c16995 2025

  7. [7]

    Eli Blevis. 2007. Sustainable Interaction Design: Invention & Disposal, Renewal & Reuse. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (San Jose, California, USA) (CHI ’07). Association for Computing Ma- chinery, New York, NY, USA, 503–512. https://doi.org/10.1145/1240624.1240705

    arXiv 2007

  8. [8]

    Leah Buechley, Ruby Ta, and Alyssa Johnson. 2023. 3D Printable Play-Dough. In Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems (CHI EA ’23). Association for Computing Machinery, New York, NY, USA, Article 428, 4 pages. https://doi.org/10.1145/3544549.3583927

    arXiv 2023

Show all 77 references
  1. [9]

    Siqi Chen, Hao Yang, Kui Huang, Xiaolong Ge, Hanpeng Yao, Junxiang Tang, Junxue Ren, Shixue Ren, and Yanli Ma. 2021. Quantitative study on solubil- ity parameters and related thermodynamic parameters of PVA with different alcoholysis degrees. Polymers 13, 21 (2021), 3778

    2021

  2. [10]

    Ta, Takuya Sasatani, Eric Markvicka, Yoshihiro Kawahara, Lining Yao, Gregory D

    Tingyu Cheng, Koya Narumi, Youngwook Do, Yang Zhang, Tung D. Ta, Takuya Sasatani, Eric Markvicka, Yoshihiro Kawahara, Lining Yao, Gregory D. Abowd, and HyunJoo Oh. 2020. Silver Tape: Inkjet-Printed Circuits Peeled-and- Transferred on Versatile Substrates.Proc. ACM Interact. Mo...

    2020 doi

  3. [11]

    Abowd, Hyunjoo Oh, and Andreea Danielescu

    Tingyu Cheng, Taylor Tabb, Jung Wook Park, Eric M Gallo, Aditi Maheshwari, Gregory D. Abowd, Hyunjoo Oh, and Andreea Danielescu. 2023. Functional Destruction: Utilizing Sustainable Materials’ Physical Transiency for Electronics Applications. In Proceedings of the 2023 CHI Conf...

    2023

  4. [12]

    Tingyu Cheng, Zhihan Zhang, Han Huang, Yingting Gao, Wei Sun, Gregory D Abowd, HyunJoo Oh, and Josiah Hester. 2024. Recy-ctronics: Designing Fully Recyclable Electronics With Varied Form Factors. arXiv preprint arXiv:2406.09611 (2024)

    2024 arXiv

  5. [13]

    Jirang Cui and Eric Forssberg. 2003. Mechanical recycling of waste electric and electronic equipment: a review. Journal of hazardous materials 99, 3 (2003), 243–263

    2003

  6. [14]

    Himani Deshpande, Haruki Takahashi, and Jeeeun Kim. 2024. Unmake to Remake: Materiality-Driven Rapid Prototyping. ACM Trans. Comput.-Hum. Interact. 31, 6, Article 78 (Dec. 2024), 31 pages. https://doi.org/10.1145/3685270

    2024 doi

  7. [15]

    Michael D. Dickey. 2017. Stretchable and Soft Electronics Using Liquid Metals. Advanced Materials 29, 27 (2017), 1606425

    2017

  8. [16]

    Michael D Dickey, Ryan C Chiechi, Ryan J Larsen, Emily A Weiss, David A Weitz, and George M Whitesides. 2008. Eutectic gallium-indium (EGaIn): a liquid metal alloy for the formation of stable structures in microchannels at room temperature. Advanced functional materials 18, 7 ...

    2008

  9. [17]

    ecoinvent Association. [n.d.]. ecoinvent v3.10: Life Cycle Inventory (LCI) Data- base. https://ecoinvent.org/ecoinvent-v3-10/. Accessed: April 06, 2025

    2025

  10. [18]

    electronicsworkshops. 2024. MX1508 motor driver module. https://hackaday.io/ project/197831-mx1508-motor-driver-module. Accessed: July 09, 2025

    2024

  11. [19]

    Elmer’s. [n.d.]. Liquid School Glue. https://www.elmers.com/glue/liquid-school- glue/. Accessed: April 06, 2025

    2025

  12. [20]

    Andrew Fassler and Carmel Majidi. 2015. Liquid-phase metal inclusions for a conductive polymer composite. Adv. Mater 27, 11 (2015), 1928–1932

    2015

  13. [21]

    Filabot. 2024. Filabot Original EX2. https://www.filabot.com/collections/filabot- core/products/filabot-original-ex2. Accessed: April 06, 2025

    2024

  14. [22]

    FreeCAD Community. [n.d.]. FreeCAD: Open-Source Parametric 3D CAD Mod- eler. https://www.freecad.org/. Accessed: April 06, 2025

    2025

  15. [23]

    GreenDelta GmbH. [n.d.]. openLCA: Free and Open Source Life Cycle Assessment Software. https://www.openlca.org/. Accessed: April 06, 2025

    2025

  16. [24]

    Breen, Jenny Hu, Lifeng Zhu, Ye Tao, Tyson Van de Zande, Guanyun Wang, Yongjie Jessica Zhang, and Lining Yao

    Jianzhe Gu, David E. Breen, Jenny Hu, Lifeng Zhu, Ye Tao, Tyson Van de Zande, Guanyun Wang, Yongjie Jessica Zhang, and Lining Yao. 2019. Geodesy: Self- rising 2.5D Tiles by Printing along 2D Geodesic Closed Path. InProceedings of the 2019 CHI Conference on Human Factors in Com...

    2019

  17. [25]

    Vijay Kumar Guna, Geethapriya Murugesan, Bhuvaneswari Hulikal Basavaraja- iah, Manikandan Ilangovan, Sharon Olivera, Venkatesh Krishna, and Narendra DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PV A Substrates UIST ’25, September 28-Octo...

    2016

  18. [26]

    Sofía Guridi, Emmi Pouta, Ari Hokkanen, and Aayush Jaiswal. 2023. LIGHT TISSUE: Development of Cellulose-Based Optical Textile Sensors. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction (Warsaw, Poland) (TEI ’23). Associ...

    2023

  19. [27]

    Michael Z Hauschild, Ralph K Rosenbaum, Stig Irving Olsen, et al . 2018. Life Cycle Assessment: Theory and Practice . Springer International Publishing, Cham, Switzerland. https://doi.org/10.1007/978-3-319-56475-3

    2018 doi

  20. [28]

    Wittkopf, Ji Won Jun, Kris Erickson, and Rafael Tico Ballagas

    Liang He, Jarrid A. Wittkopf, Ji Won Jun, Kris Erickson, and Rafael Tico Ballagas

  21. [29]

    Hillaire, Michael David Dickey, and Karen E

    Keith D. Hillaire, Michael David Dickey, and Karen E. Daniels. 2020. Marangoni Fingering Instabilities in Oxidizing Liquid Metals. arXiv: Fluid Dynamics (2020). https://api.semanticscholar.org/CorpusID:227054206

    2020

  22. [30]

    Xian Huang, Yuhao Liu, Suk-Won Hwang, Seung-Kyun Kang, Dwipayan Patnaik, Jonathan Fajardo Cortes, and John A. Rogers. 2014. Biodegradable Materials for Multilayer Transient Printed Circuit Boards. Advanced Materials 26, 43 (2014), 7371–7377. https://onlinelibrary.wiley.com/doi...

    2014 doi

  23. [31]

    Brenckle, Bruce Panilaitis, Sang Min Won, Yun-Soung Kim, Young Min Song, Ki Jun Yu, Abid Ameen, Rui Li, Yewang Su, Miao- miao Yang, David L

    Suk-Won Hwang, Hu Tao, Dae-Hyeong Kim, Huanyu Cheng, Jun-Kyul Song, Elliott Rill, Mark A. Brenckle, Bruce Panilaitis, Sang Min Won, Yun-Soung Kim, Young Min Song, Ki Jun Yu, Abid Ameen, Rui Li, Yewang Su, Miao- miao Yang, David L. Kaplan, Mitchell R. Zakin, Marvin J. Slepian, ...

    2012 doi

  24. [32]

    Deloitte Insights. 2025. 2025 Global Semiconductor Industry Outlook. https://www2.deloitte.com/us/en/insights/industry/technology/technology- media-telecom-outlooks/semiconductor-industry-outlook.html. Accessed: April 06, 2025

    2025

  25. [33]

    Institute of Environmental Sciences (CML), Leiden University. 2016. CML-IA Characterisation Factors for Life Cycle Impact Assessment. https://www.universiteitleiden.nl/en/research/research-output/science/cml-ia- characterisation-factors. Accessed: April 06, 2025

    2016

  26. [34]

    International Electrotechnical Commission. 2013. IEC 60529: Degrees of Protec- tion Provided by Enclosures (IP Code). https://www.iec.ch/ip-ratings

    2013

  27. [35]

    Ayaka Ishii, Kunihiro Kato, Kaori Ikematsu, Yoshihiro Kawahara, and Itiro Siio

  28. [36]

    Jiva Materials. [n.d.]. Jiva Materials. https://www.jivamaterials.com/. Accessed: April 06, 2025

    2025

  29. [37]

    Cook, Cheng Zhang, and Gre- gory D

    Yoshihiro Kawahara, Steve Hodges, Benjamin S. Cook, Cheng Zhang, and Gre- gory D. Abowd. 2013. Instant Inkjet Circuits: Lab-Based Inkjet Printing to Support Rapid Prototyping of UbiComp Devices. In Proceedings of the 2013 ACM International Joint Conference on Pervasive and Ubi...

    2013

  30. [38]

    KiCad Project. [n.d.]. KiCad EDA: A Cross-Platform Open-Source Electronics Design Automation Suite. https://kicad.org/. Accessed: April 06, 2025

    2025

  31. [39]

    Peeranart Kiddee, Ravi Naidu, and Ming H. Wong. 2013. Electronic waste man- agement approaches: An overview. Waste Management 33, 5 (2013), 1237–1250

    2013

  32. [40]

    Sunyoung Kim and Eric Paulos. 2011. Practices in the Creative Reuse of E-Waste. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (Vancouver, BC, Canada) (CHI ’11). Association for Computing Machinery, New York, NY, USA, 2395–2404. https://doi.org/1...

    2011

  33. [41]

    Marion Koelle, Madalina Nicolae, Aditya Shekhar Nittala, Marc Teyssier, and Jürgen Steimle. 2022. Prototyping Soft Devices with Interactive Bioplastics. In Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology (Bend, OR, USA) (UIST ’22). Associ...

    2022

  34. [42]

    Lazaro Vasquez, Mirela Alistar, Laura Devendorf, and Michael L

    Eldy S. Lazaro Vasquez, Mirela Alistar, Laura Devendorf, and Michael L. Rivera

  35. [44]

    Jasmine Lu, Sai Rishitha Boddu, and Pedro Lopes. 2025. ProtoPCB: Reclaiming Printed Circuit Board E-waste as Prototyping Material. In Proceedings of the 2025 CHI Conference on Human Factors in Computing Systems (CHI ’25) . Association for Computing Machinery, New York, NY, USA...

    2025 doi

  36. [45]

    Maurice, Khang Ngoc Dinh, Nicolas M

    Ange A. Maurice, Khang Ngoc Dinh, Nicolas M. Charpentier, Andrea Brambilla, and Jean-Christophe P. Gabriel. 2021. Dismantling of Printed Circuit Boards Enabling Electronic Components Sorting and Their Subsequent Treatment Open Improved Elemental Sustainability Opportunities. S...

    2021 doi

  37. [46]

    Farhang Momeni, Seyed M.Mehdi Hassani.N, Xun Liu, and Jun Ni. 2017. A review of 4D printing. Materials & Design 122 (2017), 42–79. https://doi.org/10.1016/j. matdes.2017.02.068

    2017 doi

  38. [47]

    Martin Murer, Anna Vallgårda, Mattias Jacobsson, and Manfred Tscheligi. 2015. Un-Crafting: Exploring Tangible Practices for Deconstruction in Interactive System Design. In Proceedings of the Ninth International Conference on Tangi- ble, Embedded, and Embodied Interaction (Stan...

    2015

  39. [48]

    Steven Nagels, Raf Ramakers, Kris Luyten, and Wim Deferme. 2018. Sili- cone Devices: A Scalable DIY Approach for Fabricating Self-Contained Multi- Layered Soft Circuits using Microfluidics. In Proceedings of the 2018 CHI Con- ference on Human Factors in Computing Systems (Mont...

    2018

  40. [49]

    Chu, John A

    Y-L Park, Sechang Ryu, Barnabás Póczos, Kyeong-Sik Shin, Bongsoo Lee, Ung B. Chu, John A. Rogers, Sooyoung Shin, Seon Jeong Kim, et al. 2010. Hyperelastic Pressure Sensing with a Liquid-Embedded Elastomer. Journal of Micromechanics and Microengineering 20, 12 (2010), 125029

    2010

  41. [50]

    Narjes Pourjafarian, Zhenming Yang, Jeffrey Lipton, Benyamin Davaji, and Gre- gory D Abowd. 2025. ProForm: Solder-Free Circuit Assembly Using Thermoform- ing. In Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technologys (Busan, Republic of Korea)(...

    2025

  42. [51]

    Rivera, S

    Michael L. Rivera, S. Sandra Bae, and Scott E. Hudson. 2023. Designing a Sus- tainable Material for 3D Printing with Spent Coffee Grounds. In Proceedings of the 2023 ACM Designing Interactive Systems Conference (Pittsburgh, PA, USA) (DIS ’23). Association for Computing Machine...

    2023

  43. [52]

    Valkyrie Savage, Ryan Schmidt, Tovi Grossman, George Fitzmaurice, and Björn Hartmann. 2014. A series of tubes: adding interactivity to 3D prints using internal pipes. In Proceedings of the 27th Annual ACM Symposium on User Interface Software and Technology (Honolulu, Hawaii, U...

    2014

  44. [53]

    Katherine W Song, Fiona Bell, Himani Deshpande, Ilan Mandel, Tiffany Wun, Mirela Alistar, Leah Buechley, Wendy Ju, Jeeeun Kim, Eric Paulos, et al . 2024. Sustainable Unmaking: Designing for Biodegradation, Decay, and Disassembly. In Extended Abstracts of the CHI Conference on ...

    2024

  45. [54]

    Katherine W Song, Aditi Maheshwari, Eric M Gallo, Andreea Danielescu, and Eric Paulos. 2022. Towards Decomposable Interactive Systems: Design of a Backyard-Degradable Wireless Heating Interface. In Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems (N...

    2022

  46. [55]

    Katherine W Song and Eric Paulos. 2021. Unmaking: Enabling and Celebrating the Creative Material of Failure, Destruction, Decay, and Deformation. InProceedings of the 2021 CHI Conference on Human Factors in Computing Systems (CHI ’21) . Association for Computing Machinery, New...

    2021

  47. [56]

    Katherine W Song and Eric Paulos. 2023. Vim: Customizable, Decomposable Electrical Energy Storage. In Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (Hamburg, Germany) (CHI ’23). Association for Computing Machinery, New York, NY, USA, Article 180,...

    2023

  48. [57]

    Long Teng, Li Li, Jingxia Huang, Shuai Li, Renchao Hu, Xuechang Zhou, and Hong Wang. 2023. Fully Recyclable Liquid-Metal-Based Multi-Layer Thermally Triggered Transient Electronic Devices. Advanced Materials Technologies 8, 4 (2023), 2201031

    2023

  49. [58]

    Long Teng, Shichao Ye, Stephan Handschuh-Wang, Xiaohu Zhou, Tiansheng Gan, and Xuechang Zhou. 2019. Liquid metal-based transient circuits for flexible and recyclable electronics. Advanced Functional Materials 29, 11 (2019), 1808739

    2019

  50. [59]

    Yutaka Tokuda, Deepak Ranjan Sahoo, Matt Jones, Sriram Subramanian, and Anusha Withana. 2021. Flowcuits: Crafting Tangible and Interactive Electrical Components with Liquid Metal Circuits. In Proceedings of the Fifteenth Interna- tional Conference on Tangible, Embedded, and Em...

    2021

  51. [60]

    Lazaro Vasquez and Katia Vega

    Eldy S. Lazaro Vasquez and Katia Vega. 2019. From plastic to biomaterials: proto- typing DIY electronics with mycelium. In Adjunct Proceedings of the 2019 ACM UIST ’25, September 28-October 1, 2025, Busan, Republic of Korea Yan, et al. International Joint Conference on Pervasi...

    2019

  52. [61]

    Lazaro Vasquez and Katia Vega

    Eldy S. Lazaro Vasquez and Katia Vega. 2019. Myco-Accessories: Sustain- able Wearables with Biodegradable Materials. In Proceedings of the 2019 ACM International Symposium on Wearable Computers (London, United Kingdom) (ISWC ’19). Association for Computing Machinery, New York,...

    2019

  53. [62]

    Ludwig Wilhelm Wall, Alec Jacobson, Daniel Vogel, and Oliver Schneider. 2021. Scrappy: Using Scrap Material as Infill to Make Fabrication More Sustainable. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI ’21). Association ...

    2021

  54. [63]

    Ludwig Wilhelm Wall, Oliver Schneider, and Daniel Vogel. 2023. Substiports: User-Inserted Ad Hoc Objects as Reusable Structural Support for Unmodified FDM 3D Printers. In Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology(San Francisco, CA, ...

    2023

  55. [64]

    Guanyun Wang, Tingyu Cheng, Youngwook Do, Humphrey Yang, Ye Tao, Jianzhe Gu, Byoungkwon An, and Lining Yao. 2018. Printed Paper Actuator: A Low-Cost Reversible Actuation and Sensing Method for Shape Changing Interfaces. In Proceedings of the 2018 CHI Conference on Human Factor...

    2018

  56. [65]

    Guanyun Wang, Humphrey Yang, Zeyu Yan, Nurcan Gecer Ulu, Ye Tao, Jianzhe Gu, Levent Burak Kara, and Lining Yao. 2018. 4DMesh: 4D Printing Morph- ing Non-Developable Mesh Surfaces. In Proceedings of the 31st Annual ACM Symposium on User Interface Software and Technology (Berlin...

    2018

  57. [66]

    Sandra Bae, and Michael L

    Xin Wen, S. Sandra Bae, and Michael L. Rivera. 2025. Enabling Recycling of Multi- Material 3D Printed Objects through Computational Design and Disassembly by Dissolution. In Proceedings of the 2025 CHI Conference on Human Factors in Computing Systems (CHI ’25) . ACM, New York, NY, USA

    2025

  58. [67]

    Shanel Wu and Laura Devendorf. 2020. Unfabricate: Designing Smart Textiles for Disassembly. In Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’20). Association for Computing Machinery, New York, NY, USA, 1–14. https://doi....

    2020

  59. [68]

    Zeyu Yan, Tingyu Cheng, Jasmine Lu, Pedro Lopes, and Huaishu Peng. 2023. Future Paradigms for Sustainable Making. In Adjunct Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology(San Francisco, CA, USA) (UIST ’23 Adjunct). Association for Compu...

    2023

  60. [69]

    Zeyu Yan, Mrunal Dhagude, and Huaishu Peng. 2025. Make Making Sustainable: Exploring Sustainability Practices, Challenges, and Opportunities in Making Ac- tivities. In Proceedings of the 2025 CHI Conference on Human Factors in Computing Systems (CHI ’25). Association for Compu...

    2025

  61. [70]

    Zeyu Yan, Hsuanling Lee, Liang He, and Huaishu Peng. 2023. 3D Printing Magnetophoretic Displays. In Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology (San Francisco, CA, USA) (UIST ’23). Association for Computing Machinery, New York, NY, US...

    2023

  62. [72]

    Zeyu Yan, Advait Vartak, Jiasheng Li, Zining Zhang, and Huaishu Peng. 2025. PCB Renewal: Iterative Reuse of PCB Substrates for Sustainable Electronic Making. In Proceedings of the 2025 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI ’25). Associatio...

    2025

  63. [73]

    Azamat Yedrissov, Dmitriy Khrustalev, Alexander Alekseev, Anastassiya Khrustal- eva, and Anastassiya Vetrova. 2022. New composite material for biodegradable electronics. Materials Today: Proceedings 49 (2022), 2443–2448

    2022

  64. [74]

    Firstname Zhang and Others. 2023. vPCB: Recyclable Vitrimer-Based Circuit Boards. ACM Transactions on Graphics XX, X (2023), 1–10

    2023

  65. [75]

    Zhihan Zhang, Agni K Biswal, Ankush Nandi, Kali Frost, Jake A Smith, Bichlien H Nguyen, Shwetak Patel, Aniruddh Vashisth, and Vikram Iyer. 2024. Recyclable vitrimer-based printed circuit boards for sustainable electronics. Nature Sustain- ability 7, 5 (May 2024), 616–627. http...

    2024 doi

  66. [76]

    Jingwen Zhu, Lily Winagle, and Hsin-Liu (Cindy) Kao. 2024. EcoThreads: Proto- typing Biodegradable E-textiles Through Thread-based Fabrication. In Proceed- ings of the CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’24). Association for Computing...

    2024

  67. [2021]

    In Adjunct Proceedings of the 34th Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’21 Adjunct)

    Fabricating Wooden Circuit Boards by Laser Beam Machining. In Adjunct Proceedings of the 34th Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’21 Adjunct) . Association for Comput- ing Machinery, New York, NY, USA, 109–111. https://doi...

    doi

  68. [2022]

    ModElec: A Design Tool for Prototyping Physical Computing Devices Using Conductive 3D Printing. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 5, 4, Article 159 (Dec. 2022), 20 pages. https://doi.org/10.1145/3495000

    2022 doi

  69. [2024]

    In Proceedings of the CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’24)

    Desktop Biofibers Spinning: An Open-Source Machine for Exploring Biobased Fibers and Their Application Towards Sustainable Smart Textile Design. In Proceedings of the CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’24). Association for Computing ...

Pith tools

Reviewed August 6, 2026 · model on record in the stance chip above.