Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links, observed 2026-08-06T13:10:43.927864Z
Paper Citation Record · LEDGER
ProForm: Solder-Free Circuit Assembly Using Thermoforming
As of 16 August 2026, this Paper Citation Record lists 60 of 60 outbound references and 0 inbound Pith citation observations for arXiv:2507.20933.
A citation records a reference. It does not transfer a finding from one paper to another.
Coverage vector
One-hop event checks from named stored sources.
Source: scholarly_work_events, retraction_status_cache, observed 2026-08-16T06:30:59.297886+00:00
Pith citing papers itemized under the disclosed page cap.
Source: paper_references, paper_reference_links
A source-named dated measurement, never combined with another source.
Source: cited_works
Reference resolution
60 of 60 outbound references displayed
- verified exact2
- verified fuzzy7
- unresolved39
- parse uncertain0
- malformed identifier5
- metadata mismatch7
External citation measurements
No source-named external measurement is stored.
Outbound references
Observation 2c226564-69aa-4741-b5fd-8e37e0fcbb60 · outbound
This paper cites Electrically Conductive Adhesive Transfer Tape.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Electrically Conductive Adhesive Transfer Tape
Reference 1
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:49.185059Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation d78ccbc3-8fd5-4d44-8221-dd38758a5cec · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 2
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:46.778120Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 1ea37c10-5609-4633-8773-7e2a04fd6c1e · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 3
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:49.049006Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 0fd7bbcd-261f-4522-8135-61e8df074d74 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 4
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:46.675142Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation e3b00cb7-53d5-4f16-9f2c-6d7d020f523a · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 5
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.697422Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 053fcc6d-fd0f-4586-abf3-41c6396ec0b9 · outbound
This paper cites SMTpads-Surface mount proto PCBs.
ProForm: Solder-Free Circuit Assembly Using Thermoforming SMTpads-Surface mount proto PCBs
Reference 6
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:48.924323Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation ba4a4c96-c331-4b68-ac63-8a73eac469a8 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 7
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.705288Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation e1c67081-9fc1-4367-950b-f7296d6448c8 · outbound
This paper cites Ta, Takuya Sasatani, Eric Markvicka, Yoshihiro Kawahara, Lining Yao, Gregory D.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Ta, Takuya Sasatani, Eric Markvicka, Yoshihiro Kawahara, Lining Yao, Gregory D
Reference 8
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.709025Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 55a2ccff-1471-4ce7-9f8c-91b57aa9986f · outbound
This paper cites Abowd, Hyunjoo Oh, and Andreea Danielescu.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Abowd, Hyunjoo Oh, and Andreea Danielescu
Reference 9
- Resolution
- malformed identifier
- no resolver link, observed 2026-08-06T13:10:43.712390Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 1b9f560f-c653-4abb-bba1-714d35ee5aeb · outbound
This paper cites Recy-ctronics: Designing Fully Recyclable Electronics With Varied Form Factors.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Recy-ctronics: Designing Fully Recyclable Electronics With Varied Form Factors
Reference 10
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.716169Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 424884fc-5895-4d8e-aee2-0f035632ebec · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 12
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:46.307059Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation ec76ffae-c99d-4bfe-867a-d81d14ac7a85 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 13
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:48.756672Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 6b42f538-0a26-4119-90ab-5b9bb2caca98 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 14
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:46.222347Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation d188cfb3-260f-44fb-904b-8ede21d951e7 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 15
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.734801Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation a481c97c-75e1-4d7f-83ba-032ea4d5b719 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 16
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.738203Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation d5075896-997b-4001-bba8-0952e6543b7c · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 17
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.741810Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 3e579254-5e2b-4668-934f-a79401416ae0 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 18
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.745680Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation a32accdb-ca00-4a77-a6d9-62ca3f6a5cc4 · outbound
This paper cites Jackson and Laewoo Kang.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Jackson and Laewoo Kang
Reference 19
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.748943Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation b84fe93d-28ef-44c8-901a-11d7c92aa6a9 · outbound
This paper cites Cook, Cheng Zhang, and Gre- gory D.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Cook, Cheng Zhang, and Gre- gory D
Reference 20
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.753066Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation c26cad60-5ce2-4557-bccd-6749d5720190 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 21
- Resolution
- malformed identifier
- no resolver link, observed 2026-08-06T13:10:43.756564Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 9089e424-4580-4331-a10a-333e991cc1ac · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 22
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.760356Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 86103866-ee9f-40a9-a392-1e982767ab2c · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 23
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:48.679413Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation b948df15-e552-4e48-83dd-43ac45e0e025 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 25
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:48.495135Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 14e2f689-970d-4699-bc23-f5468e4d8870 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 26
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:45.530535Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation e74d01c7-48e8-4160-b6d9-1c5a964ed396 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 28
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:48.341634Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 4b740231-2213-4ffe-946b-c550d2e4b3b5 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 29
- Resolution
- malformed identifier
- no resolver link, observed 2026-08-06T13:10:43.791382Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 86fb22d9-217c-4b79-81d5-3ef0f46a1ef4 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 30
- Resolution
- verified exact
- doi, observed 2026-08-06T13:10:43.985227Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation d5ec96e2-13bc-4374-9567-6b2f952c6a16 · outbound
This paper cites Maurice, Khang Ngoc Dinh, Nicolas M.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Maurice, Khang Ngoc Dinh, Nicolas M
Reference 31
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.799329Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation e96bb1ca-3999-4e2f-8e35-baf8b5abf816 · outbound
This paper cites Mayku Multiplier Materials TDS.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Mayku Multiplier Materials TDS
Reference 32
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:48.182256Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 45453bee-3acd-4836-9ef7-ab1692ec2736 · outbound
This paper cites Mellis, Sam Jacoby, Leah Buechley, Hannah Perner-Wilson, and Jie Qi.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Mellis, Sam Jacoby, Leah Buechley, Hannah Perner-Wilson, and Jie Qi
Reference 33
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:48.106046Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 3493065c-c2d0-4831-9c13-d97eaccab36c · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 34
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:45.221752Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 1504ca5b-67f5-4bdb-932b-0a45227d21a0 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 35
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.819258Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 40d5c789-4bc6-47be-9f55-f237ad17853d · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 36
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:47.972813Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 4dc14e00-6bef-4818-b7c3-cf7cd2a56e80 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 37
- Resolution
- metadata mismatch
- raw_fallback, observed 2026-08-06T13:10:45.153475Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 173ce5da-f5a4-43c7-a6a8-32019d9b53d1 · outbound
This paper cites VIVAK PETG SHEET.
ProForm: Solder-Free Circuit Assembly Using Thermoforming VIVAK PETG SHEET
Reference 38
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:47.819110Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation f1414cb0-72ce-43f0-9920-8465ea9c9d3b · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 39
- Resolution
- malformed identifier
- no resolver link, observed 2026-08-06T13:10:43.833384Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation bfb7e710-683d-4d20-a658-c937b645aea4 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 41
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.840577Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 2016f4d9-4480-4e16-96c1-e1dc17c03bc4 · outbound
This paper cites Soldering Tips.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Soldering Tips
Reference 42
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:47.639155Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation d4f478ba-9322-4c52-93de-648f5f501870 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 43
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.847476Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 396bba83-a06e-4c60-8fe4-29fb5efafbbc · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 44
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.851560Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 4f6314fc-250e-463f-bcdd-4b5322563283 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 45
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.855405Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 0e09780c-a869-4433-bffb-a585e5fecab2 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 46
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.859433Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation ede57968-218d-4532-aaa5-2052d03386dd · outbound
This paper cites Lazaro Vasquez and Katia Vega.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Lazaro Vasquez and Katia Vega
Reference 47
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.863295Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation b33b80ec-090d-4b5e-9444-3b90f5f9e29f · outbound
This paper cites Lazaro Vasquez and Katia Vega.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Lazaro Vasquez and Katia Vega
Reference 48
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.867053Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation c3dc6f80-c6cc-4711-8fa7-219f3c43c0f4 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 49
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:47.578638Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation d37db3ca-e823-4c6d-88aa-df92134b3309 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 50
- Resolution
- verified exact
- doi, observed 2026-08-06T13:10:43.966688Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 26c4e0ff-04c3-461b-bb72-4d2716fabb2b · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 51
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:47.398546Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation b3cbf4bb-9db2-4176-aede-7d9f608cf49b · outbound
This paper cites Snowden, Ollie Hanton, Isabel P.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Snowden, Ollie Hanton, Isabel P
Reference 52
- Resolution
- verified fuzzy
- raw_fallback, observed 2026-08-06T13:10:47.284195Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation a2bbf8ff-dce2-4d12-a877-02aa00de87b1 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 53
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.896635Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 7df7cc9c-3fd8-400a-ad9c-ae02ef82b7dd · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 54
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.900621Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation a0e8efa5-fb34-4f1d-94ba-73dec343aa85 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 55
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:47.161981Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation 6bd6afc9-dd1c-4926-b0b4-37c8affcf1f4 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 57
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.914944Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation b2b58c2e-c379-4e84-83ff-0c17e7a18980 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 58
- Resolution
- unresolved
- raw_fallback, observed 2026-08-06T13:10:46.984279Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation e0cb3472-b758-4e07-862a-50fa53d29c04 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 59
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.921279Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 0f4dd99c-972e-4739-babc-add1d7f080c4 · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 60
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.924761Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 4764c140-ffae-4988-86d1-786acdf13c4c · outbound
This paper cites an unresolved cited work.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Unresolved cited work
Reference 61
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.927864Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 858f8216-837c-41f1-a2f9-6b9d0d9171f6 · outbound
This paper cites Untoolkit.
ProForm: Solder-Free Circuit Assembly Using Thermoforming Untoolkit
Reference 2013
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.811537Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 1fb53e5d-94fb-48e5-aab4-266de6448654 · outbound
This paper cites In Companion Publication of the 2019 on Designing Interactive Systems Conference 2019 Companion (San Diego, CA, USA) (DIS ’19 Companion).
ProForm: Solder-Free Circuit Assembly Using Thermoforming In Companion Publication of the 2019 on Designing Interactive Systems Conference 2019 Companion (San Diego, CA, USA) (DIS ’19 Companion)
Reference 2019
- Resolution
- malformed identifier
- raw_fallback, observed 2026-08-06T13:10:44.493926Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-16T06:30:59.297886+00:00.
Observation a5000f40-8f94-4980-bee8-9c9cae699dab · outbound
This paper cites In Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (Hamburg, Germany) (CHI ’23).
ProForm: Solder-Free Circuit Assembly Using Thermoforming In Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (Hamburg, Germany) (CHI ’23)
Reference 2023
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.768785Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 1a8ec7db-7644-4a2f-b26e-3f27846520c9 · outbound
This paper cites In Proceedings of the 38th Annual ACM Sym- posium on User Interface Software and Technology (Busan, Republic of Korea) (UIST ’25).
ProForm: Solder-Free Circuit Assembly Using Thermoforming In Proceedings of the 38th Annual ACM Sym- posium on User Interface Software and Technology (Busan, Republic of Korea) (UIST ’25)
Reference 2025
- Resolution
- unresolved
- no resolver link, observed 2026-08-06T13:10:43.908053Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Pith citing papers
No inbound Pith citation observations are available.