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Recy-ctronics: Designing Fully Recyclable Electronics With Varied Form Factors

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arxiv 2406.09611 v1 pith:VTXR7YHH submitted 2024-06-13 cs.HC

classification cs.HC
keywords electronicsrecyclableelectronicenvironmentalfactorsformmanufacturingmethods
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For today's electronics manufacturing process, the emphasis on stable functionality, durability, and fixed physical forms is designed to ensure long-term usability. However, this focus on robustness and permanence complicates the disassembly and recycling processes, leading to significant environmental repercussions. In this paper, we present three approaches that leverage easily recyclable materials-specifically, polyvinyl alcohol (PVA) and liquid metal (LM)-alongside accessible manufacturing techniques to produce electronic components and systems with versatile form factors. Our work centers on the development of recyclable electronics through three methods: 1) creating sheet electronics by screen printing LM traces on PVA substrates; 2) developing foam-based electronics by immersing mechanically stirred PVA foam into an LM solution; and 3) fabricating recyclable electronic tubes by injecting LM into mold cast PVA tubes, which can then be woven into various structures. To further assess the sustainability of our proposed methods, we conducted a life cycle assessment (LCA) to evaluate the environmental impact of our recyclable electronics in comparison to their conventional counterparts.

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Cited by 2 Pith papers

Reviewed papers in the Pith corpus that reference this work. Sorted by Pith novelty score. Full citation record

  1. DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates

    cs.HC 2025-07 conditional novelty 6.0 of 10

    DissolvPCB makes circuit boards from printed PVA and liquid metal traces, letting the entire assembly be recycled by dissolving it in water.

  2. ProForm: Solder-Free Circuit Assembly Using Thermoforming

    cs.HC 2025-07 conditional novelty 6.0 of 10

    ProForm is a thermoforming-based method that mounts surface-mount components with conductive tape and a plastic layer instead of solder, enabling reversible assembly and component reuse across rigid, flexible, and pap...

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