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L. Boettcher

Identifiers

  • name variant L. Boettcher 0.60 · backfill

Papers (1)

  1. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits cond-mat.mtrl-sci · 2012 · author #6

Mentions

  • 1204.1466 #6 · backfill · confidence 0.70 L. Boettcher

Frequent Coauthors