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N. Bennett

Identifiers

  • name variant N. Bennett 0.60 · backfill

Papers (1)

  1. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits cond-mat.mtrl-sci · 2012 · author #4

Mentions

  • 1204.1466 #4 · backfill · confidence 0.70 N. Bennett

Frequent Coauthors