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Weihai Bu

Identifiers

  • name variant Weihai Bu 0.60 · backfill

Papers (2)

  1. From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration cond-mat.mes-hall · 2024 · author #10
  2. A Novel Energy-Efficient Salicide-Enhanced Tunnel Device Technology Based on 300mm Foundry Platform Towards AIoT Applications cond-mat.mes-hall · 2024 · author #18

Mentions

  • 2411.00309 #10 · arxiv_oai · confidence 0.70 Weihai Bu
  • 2410.12390 #18 · arxiv_oai · confidence 0.70 Weihai Bu

Frequent Coauthors