Jack Wu

Identifiers

• name variant Jack Wu 0.60 · backfill

Papers (1)

1. From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration cond-mat.mes-hall · 2024 · author #8

Mentions

• 2411.00309 #8 · arxiv_oai · confidence 0.70 Jack Wu

Frequent Coauthors

• Falong Zhou 1 shared papers
• Haoran Lu 1 shared papers
• Heng Wu 1 shared papers
• Jiacheng Sun 1 shared papers
• Jin Kang 1 shared papers
• Lijie Zhang 1 shared papers
• Ming Li 1 shared papers
• Ru Huang 1 shared papers
• Runsheng Wang 1 shared papers
• Wanyue Peng 1 shared papers
• Weihai Bu 1 shared papers
• Xin Zhang 1 shared papers
• Yanbang Chu 1 shared papers
• Yibo Lin 1 shared papers
• Ziqiao Xu 1 shared papers