XHEMTs on Ultrawide Bandgap Single-Crystal AlN Substrates

AlN has the largest bandgap in the wurtzite III-nitride semiconductor family, making it an ideal barrier for a thin GaN channel to achieve strong carrier confinement in field-effect transistors, analogous to silicon-on-insulator technology. Unlike SiO$_2$/Si/SiO$_2$, AlN/GaN/AlN can be grown fully epitaxially, enabling high carrier mobilities suitable for high-frequency applications. However, developing these heterostructures and related devices has been hindered by challenges in strain management, polarization effects, defect control and charge trapping. Here, the AlN single-crystal high electron mobility transistor (XHEMT) is introduced, a new nitride transistor technology designed to address these issues. The XHEMT structure features a pseudomorphic GaN channel sandwiched between AlN layers, grown on single-crystal AlN substrates. First-generation XHEMTs demonstrate RF performance on par with the state-of-the-art GaN HEMTs, achieving 5.92 W/mm output power and 65% peak power-added efficiency at 10 GHz under 17 V drain bias. These devices overcome several limitations present in conventional GaN HEMTs, which are grown on lattice-mismatched foreign substrates that introduce undesirable dislocations and exacerbated thermal resistance. With the recent availability of 100-mm AlN substrates and AlN's high thermal conductivity (340 W/m$\cdot$K), XHEMTs show strong potential for next-generation RF electronics.