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REVIEW 2 major objections 3 minor 152 references

GaN Power Devices and Converter Architectures for AI Data Centers: Efficiency, Reliability, and Deployment Pathways

T0 review · 2 major / 3 minor · reviewed 2026-06-25 · grok-4.3

Pith's one-line read GaN provides efficiency advantages only in specific stages of AI data center power conversion.

desk verdict This is a review that maps GaN to data center power stages without adding new results. read the letter →

arxiv 2606.25281 v1 pith:E4GQCD4Y submitted 2026-06-24 physics.app-ph cs.SYeess.SY

classification physics.app-phcs.SYeess.SY
keywords GaNpowerdevicesdatacentersAIworkloadsconverterefficiencyconversionreliabilitygalliumnitride
verification ladder T0 review T1 audit T2 compute T3 formal

The pith

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The reading

This review analyzes the role of gallium-nitride power devices in meeting the rising power demands of AI data centers. It evaluates GaN against silicon and silicon-carbide technologies at each stage of the power delivery chain from the grid to the processors. The key result is that GaN's benefits are stage-dependent, strongest in high-frequency low-to-mid voltage applications with lateral devices, rather than a blanket replacement. Such targeted use can lower electrical losses, reduce cooling needs, and decrease overall energy consumption and carbon emissions. The paper also identifies packaging, control, and reliability requirements for practical deployment.

What carries the argument

The quantitative framework that links cascaded converter efficiency to reductions in electrical losses, cooling demand, annual facility energy use, and operational carbon emissions.

What would settle it

Direct measurements in an AI data center that show no corresponding reduction in annual energy consumption or carbon emissions from the use of GaN converters in the stages where advantages are claimed.

Watch

Extended reading notes

Core claim

The analysis shows that GaN provides a stage-dependent rather than universal advantage. Commercial lateral GaN HEMTs are particularly effective in high-frequency, low-to-mid-voltage stages, while specialized and hybrid devices support bidirectional operation, normally-off control, extreme conversion ratios, and integration. Vertical GaN remains an emerging option for higher-voltage and higher-power conversion. A quantitative framework links cascaded converter efficiency to electrical-loss reduction, cooling demand, annual facility energy use, and operational carbon emissions. Broad deployment further requires low-parasitic packaging, disciplined gate-drive and EMI co-design, mission-profile

Load-bearing premise

Converter-relevant metrics such as voltage scalability and switching behavior are sufficient to determine stage suitability and the quantitative framework accurately connects efficiency gains to facility-level energy and carbon reductions without additional mission-profile data.

Editorial extensions

If this is right

  • Lateral GaN HEMTs are effective in high-frequency, low-to-mid-voltage stages.
  • Specialized and hybrid GaN devices enable bidirectional operation and extreme conversion ratios.
  • Vertical GaN is suited for higher-voltage and higher-power conversion.
  • Efficiency gains reduce facility energy use and carbon emissions.
  • Deployment requires low-parasitic packaging, gate-drive and EMI co-design, and reliability qualification.

Reading between the lines

Editorial extensions of the paper, not claims the author makes directly.

  • The stage-matching logic may apply to power systems in other large-scale computing installations.
  • Incorporating real-time workload data could improve the accuracy of the energy and carbon projections.
  • Validation through operational data from deployed systems would test the framework's predictions.
  • Hybrid approaches combining GaN with other technologies could ease the transition to new architectures.
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Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, simulated authors' rebuttal, and a circularity audit.

Referee Report

2 major / 3 minor

Summary. The manuscript is a review of gallium-nitride (GaN) power devices and converter architectures for AI data centers. It compares Si, SiC, and GaN (lateral HEMTs, vertical, specialized/hybrid) across grid-to-load stages (PFC, isolated DC/DC, 48 V bus, point-of-load) using metrics of voltage scalability, switching behavior, reverse conduction, thermal pathways, gate control, and maturity. The central claim is that GaN advantages are stage-dependent rather than universal, with commercial lateral devices suited to high-frequency low-to-mid voltage stages and other variants enabling bidirectional or extreme-ratio operation. A quantitative framework maps cascaded efficiency gains to facility-level electrical losses, cooling, annual energy use, and carbon emissions. Deployment requirements (packaging, gate-drive/EMI co-design, reliability qualification, manufacturing, supply-chain) are also discussed.

Significance. If the stage-dependent mapping is accepted, the review offers a structured synthesis that could guide device-topology selection in power-hungry AI data centers. The attempt to link converter-level metrics to facility energy and carbon outcomes via a quantitative framework is a constructive element, even at high level. As a literature-based review without new derivations or datasets, its contribution lies in organization and system-level perspective rather than primary data.

major comments (2)
  1. [Quantitative framework (described in abstract and main text)] The quantitative framework is invoked to connect cascaded converter efficiency to facility energy and carbon reductions, yet the manuscript supplies no equations, parameter definitions, example calculations, or sensitivity analysis. This absence makes the facility-level claims difficult to evaluate and is load-bearing for the broader-impact argument.
  2. [Device evaluation and architecture sections] Device and architecture comparisons rely on qualitative metric descriptions without data tables, numerical benchmarks drawn from specific converter implementations, or error ranges. This limits the concreteness of the stage-dependent suitability conclusions.
minor comments (3)
  1. [Abstract] The abstract states comparative conclusions but does not preview any concrete efficiency deltas or example numbers that appear later in the text.
  2. [Deployment pathways discussion] Terminology such as 'mission-profile reliability qualification' and 'low-parasitic packaging' would benefit from a short parenthetical definition or literature pointer on first use.
  3. [Conclusion or results synthesis] A summary table listing stage, preferred GaN variant, and key metric advantages would improve readability and reinforce the stage-dependent claim.

Simulated Author's Rebuttal

2 responses · 0 unresolved

We thank the referee for the constructive review and recommendation for minor revision. The comments identify opportunities to strengthen the presentation of the quantitative framework and the concreteness of the comparisons. We respond to each major comment below and will revise the manuscript accordingly.

read point-by-point responses
  1. Referee: [Quantitative framework (described in abstract and main text)] The quantitative framework is invoked to connect cascaded converter efficiency to facility energy and carbon reductions, yet the manuscript supplies no equations, parameter definitions, example calculations, or sensitivity analysis. This absence makes the facility-level claims difficult to evaluate and is load-bearing for the broader-impact argument.

    Authors: We agree that the absence of explicit equations and worked examples limits evaluability. Although the manuscript is a review that synthesizes existing literature on cascaded efficiencies rather than deriving new models, we will add a dedicated subsection in the revision. This will include the core mapping equations, parameter definitions (e.g., stage efficiencies, load profiles, utilization factors), a numerical example for a representative AI data-center power chain, and a brief sensitivity discussion on key variables. These additions will be drawn from referenced prior work and will make the facility-level claims transparent. revision: yes

  2. Referee: [Device evaluation and architecture sections] Device and architecture comparisons rely on qualitative metric descriptions without data tables, numerical benchmarks drawn from specific converter implementations, or error ranges. This limits the concreteness of the stage-dependent suitability conclusions.

    Authors: The comparisons synthesize metrics from published datasheets, prototype reports, and reliability studies. To increase concreteness, we will insert summary tables in the revised manuscript that tabulate numerical benchmarks (efficiency, switching loss, voltage rating, power density) from representative converter implementations cited in the text, along with notes on test conditions. Where the source literature reports ranges or uncertainties, these will be indicated. This addition preserves the review character while directly addressing the request for quantitative support. revision: yes

Circularity Check

0 steps flagged · score 0.0 of 10

Review paper with no internal derivations or predictions

full rationale

This document is a review article that surveys existing GaN device literature and converter architectures, comparing standard metrics (voltage scalability, switching behavior, etc.) drawn from prior publications. It contains no equations, no fitted parameters, no new predictions, and no derivation chain that could reduce to its own inputs. The high-level quantitative framework linking cascaded efficiency to facility energy use is presented as a conceptual mapping rather than a self-contained model or fit. All claims rest on external references without self-citation load-bearing or self-definitional steps, rendering the analysis self-contained against external benchmarks.

Assumptions & free parameters 0 free parameters · 0 assumptions · 0 invented entities

As a review the paper introduces no new free parameters, axioms, or invented entities; it relies on standard semiconductor device physics and converter metrics drawn from prior work.

how reviews work

0 comments
Cite this review

Pith. "Pith review of GaN Power Devices and Converter Architectures for AI Data Centers: Efficiency, Reliability, and Deployment Pathways." pith.science (2026). https://pith.science/paper/E4GQCD4Y

@misc{pith2026260625281,
  author       = {Pith},
  title        = {Pith review of: GaN Power Devices and Converter Architectures for AI Data Centers: Efficiency, Reliability, and Deployment Pathways},
  year         = {2026},
  howpublished = {\url{https://pith.science/paper/E4GQCD4Y}},
  note         = {Machine review of arXiv:2606.25281}
}
read the original abstract

The growth of artificial-intelligence workloads is increasing the electrical and thermal demands on data-center power-delivery systems, making conversion efficiency, power density, and reliability critical design priorities. This review examines how gallium-nitride (GaN) power devices can be matched to specific stages of the grid-to-load conversion chain, including power-factor correction, isolated DC/DC conversion, 48-V intermediate-bus conversion, and point-of-load regulation. Si, SiC, and GaN are compared using converter-relevant metrics, and lateral, vertical, and specialized GaN architectures are evaluated in terms of voltage scalability, switching behavior, reverse conduction, thermal pathways, gate control, and technology maturity. The analysis shows that GaN provides a stage-dependent rather than universal advantage. Commercial lateral GaN HEMTs are particularly effective in high-frequency, low-to-mid-voltage stages, while specialized and hybrid devices support bidirectional operation, normally-off control, extreme conversion ratios, and integration. Vertical GaN remains an emerging option for higher-voltage and higher-power conversion. A quantitative framework links cascaded converter efficiency to electrical-loss reduction, cooling demand, annual facility energy use, and operational carbon emissions. Broad deployment further requires low-parasitic packaging, disciplined gate-drive and EMI co-design, mission-profile reliability qualification, scalable manufacturing, and supply-chain resilience. GaN is therefore best treated as a stage-specific system lever whose value depends on coordinated device, topology, package, and thermal co-design.

Figures

Figures reproduced from arXiv: 2606.25281 by the authors.

Figure 1
Figure 1. Conceptual relationship between conversion losses, waste heat, and [PITH_FULL_IMAGE:figures/full_fig_p001_1.png] view at source ↗
Figure 2
Figure 2. Power conversion and distribution chain in an AI/data-center environment. [PITH_FULL_IMAGE:figures/full_fig_p002_2.png] view at source ↗
Figure 3
Figure 3. Illustrative comparison of switching-frequency and power-density envelopes for Si, SiC, and GaN devices. [PITH_FULL_IMAGE:figures/full_fig_p003_3.png] view at source ↗
Figures from the paper (7 more)
Figure 4
Figure 4. Figure 4: Material performance comparison: (A) Fundamental relationship between breakdown field ( [PITH_FULL_IMAGE:figures/full_fig_p004_4.png]
Figure 5
Figure 5. Figure 5: Overview of GaN power-device architectures and their converter-level positioning. (A) Lateral GaN/AlGaN HEMT structure and representative [PITH_FULL_IMAGE:figures/full_fig_p006_5.png]
Figure 6
Figure 6. Figure 6: Mapping of GaN device classes onto a representative data-center power-delivery chain using stage-level operating domains and reported performance [PITH_FULL_IMAGE:figures/full_fig_p010_6.png]
Figure 7
Figure 7. Figure 7: (a) Incremental energy-flow model for a representative cascaded data-center power-delivery chain. For a fixed delivered IT load, the stage efficiencies [PITH_FULL_IMAGE:figures/full_fig_p015_7.png]
Figure 8
Figure 8. Figure 8: Staged deployment roadmap for GaN devices across representative data-center PFC, isolated DC/DC, 48-V front-stage, and PoL conversion functions. [PITH_FULL_IMAGE:figures/full_fig_p018_8.png]
Figure 9
Figure 9. Figure 9: System-level GaN converter design workflow showing the coupling among device selection, package and interconnect parasitics, PCB layout, gate drive [PITH_FULL_IMAGE:figures/full_fig_p020_9.png]
Figure 10
Figure 10. Figure 10: Qualitative matrix of deployment-limiting challenges for GaN data-center power conversion. Rows identify device, packaging, qualification, [PITH_FULL_IMAGE:figures/full_fig_p021_10.png]

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Reference graph

Works this paper leans on

152 extracted references · 2 canonical work pages

  1. [1]

    Power consumption and heat dissipation in ai data centers: A comparative analysis,

    K. N. K. C. Sunkara, “Power consumption and heat dissipation in ai data centers: A comparative analysis,” 2025

  2. [2]

    AI Load Dynamics--A Power Electronics Perspective

    Y . Li and Y . Li, “Ai load dynamics–a power electronics perspective,”arXiv preprint arXiv:2502.01647, 2025

  3. [3]

    Prediction of overall energy consumption of data centers in different locations,

    Y . Zhang and J. Liu, “Prediction of overall energy consumption of data centers in different locations,” Sensors, vol. 22, no. 10, p. 3704, 2022

  4. [4]

    Technology and applications of wide bandgap semiconductor materials: current state and future trends,

    O. S. Chaudhary, M. Denaï, S. S. Refaat, and G. Pis- sanidis, “Technology and applications of wide bandgap semiconductor materials: current state and future trends,” Energies, vol. 16, no. 18, p. 6689, 2023

  5. [5]

    Gallium nitride power devices in power electronics applications: State of art and perspectives,

    S. Musumeci and V . Barba, “Gallium nitride power devices in power electronics applications: State of art and perspectives,”Energies, vol. 16, no. 9, p. 3894, 2023

  6. [6]

    Gan-based power devices: Physics, reliability, and perspectives,

    M. Meneghini, C. De Santi, I. Abid, M. Buffolo, M. Cioni, R. A. Khadar, L. Nela, N. Zagni, A. Chini, F. Medjdoubet al., “Gan-based power devices: Physics, reliability, and perspectives,”Journal of Applied Physics, vol. 130, no. 18, 2021

  7. [7]

    Advancements in energy efficient gan power devices and power modules for electric vehicle applications: A review,

    R. T. Yadlapalli, A. Kotapati, R. Kandipati, S. R. Balusu, and C. S. Koritala, “Advancements in energy efficient gan power devices and power modules for electric vehicle applications: A review,”International Journal of Energy Research, vol. 45, no. 9, pp. 12 638–12 664, 2021

  8. [8]

    Technology and reliability of normally-off gan hemts with p-type gate,

    M. Meneghini, O. Hilt, J. Wuerfl, and G. Meneghesso, “Technology and reliability of normally-off gan hemts with p-type gate,”Energies, vol. 10, no. 2, p. 153, 2017

Show all 152 references
  1. [9]

    Vertical gan mosfet power devices,

    C. Langpoklakpam, A.-C. Liu, Y .-K. Hsiao, C.-H. Lin, and H.-C. Kuo, “Vertical gan mosfet power devices,” Micromachines, vol. 14, no. 10, p. 1937, 2023

  2. [10]

    Vertical gan and vertical ga2o3 power transistors: status and challenges,

    C. Gupta and S. S. Pasayat, “Vertical gan and vertical ga2o3 power transistors: status and challenges,”physica status solidi (a), vol. 219, no. 7, p. 2100659, 2022

  3. [11]

    An optimized vertical gan parallel split gate trench mosfet device structure for improved switching performance,

    N. K. Jaiswal and V . Ramakrishnan, “An optimized vertical gan parallel split gate trench mosfet device structure for improved switching performance,”IEEE access, vol. 11, pp. 46 998–47 006, 2023

  4. [12]

    Experimental evaluation of medium-voltage cascode gallium nitride (gan) devices for bidirectional dc-dc converters,

    S. S. Alharbi and M. Matin, “Experimental evaluation of medium-voltage cascode gallium nitride (gan) devices for bidirectional dc-dc converters,”CES Transactions on Electrical Machines and Systems, vol. 5, no. 3, pp. 232–248, 2021

  5. [13]

    Gan power transistors in converter design techniques,

    P. J. Chrzan and P. B. Derkacz, “Gan power transistors in converter design techniques,”Energies, vol. 18, no. 11, p. 2890, 2025

  6. [14]

    Fundamental research on semiconductor sic and its applications to power electronics,

    H. Matsunami, “Fundamental research on semiconductor sic and its applications to power electronics,”Proceed- ings of the Japan Academy, Series B, vol. 96, no. 7, pp. 235–254, 2020

  7. [15]

    Sic semiconductor devices technology, modeling and simulation,

    T. Ayalew, “Sic semiconductor devices technology, modeling and simulation,” Ph.D. dissertation, Technische Universität Wien, 2004

  8. [16]

    Challenges in sic power mosfet design,

    K. Matocha, “Challenges in sic power mosfet design,” Solid-State Electronics, vol. 52, no. 10, pp. 1631–1635, 2008

  9. [17]

    Applicability analysis of high-voltage transmission and substation equipment based on silicon carbide devices,

    H. Zhang, M. Nie, Q. Dong, H. Liu, P. Jia, Z. Li, and Y . Fang, “Applicability analysis of high-voltage transmission and substation equipment based on silicon carbide devices,”Micromachines, vol. 16, no. 11, p. 1192, 2025

  10. [18]

    New fom- based performance evaluation of 600/650 v sic and gan semiconductors for next-generation ev drives,

    D. Cittanti, E. Vico, and I. R. Bojoi, “New fom- based performance evaluation of 600/650 v sic and gan semiconductors for next-generation ev drives,”IEEE Access, vol. 10, pp. 51 693–51 707, 2022

  11. [19]

    Study on the grinding mechanism of single-crystal gan based on atomic scale and stress field modeling,

    H. Dai, T. Song, and H. Du, “Study on the grinding mechanism of single-crystal gan based on atomic scale and stress field modeling,”Materials Science in Semi- conductor Processing, vol. 204, p. 110313, 2026

  12. [20]

    Power electronics revolutionized: A comprehensive analysis of emerging wide and ultrawide bandgap devices,

    S. S. H. Rafin, R. Ahmed, M. A. Haque, M. K. Hossain, M. A. Haque, and O. A. Mohammed, “Power electronics revolutionized: A comprehensive analysis of emerging wide and ultrawide bandgap devices,”Micromachines, vol. 14, no. 11, p. 2045, 2023

  13. [21]

    Status and prospects of wide bandgap semiconductor devices,

    M. Zhang and Y . Zhang, “Status and prospects of wide bandgap semiconductor devices,”Applied and Computational Engineering, vol. 23, pp. 252–262, 2023

  14. [22]

    Reliability, applications and challenges of gan hemt technology for modern power devices: A review,

    N. Islam, M. F. P. Mohamed, M. F. A. J. Khan, S. Falina, H. Kawarada, and M. Syamsul, “Reliability, applications and challenges of gan hemt technology for modern power devices: A review,”Crystals, vol. 12, no. 11, p. 1581, 2022

  15. [23]

    Review of gan hemt appli- cations in power converters over 500 w,

    C.-T. Ma and Z.-H. Gu, “Review of gan hemt appli- cations in power converters over 500 w,”Electronics, vol. 8, no. 12, p. 1401, 2019

  16. [24]

    A deep dive into sic and gan power devices: Advances and prospects,

    J. Shi, “A deep dive into sic and gan power devices: Advances and prospects,”Appl. Comput. Eng, vol. 23, no. 1, pp. 230–237, 2023

  17. [25]

    Advancing gan power ics: Efficiency, relia- bility & autonomy,

    D. Kinzer, “Advancing gan power ics: Efficiency, relia- bility & autonomy,” in2022 24th European Conference on Power Electronics and Applications (EPE’22 ECCE Europe). IEEE, 2022, pp. 1–2

  18. [26]

    Gallium nitride power devices: a state of the art review,

    A. Udabe, I. Baraia-Etxaburu, and D. G. Diez, “Gallium nitride power devices: a state of the art review,”IEEE Access, vol. 11, pp. 48 628–48 650, 2023

  19. [27]

    Comments: Grabbing the brass ring to power the demand for data centers and generative ai,

    P. Boschee, “Comments: Grabbing the brass ring to power the demand for data centers and generative ai,” Journal of Petroleum Technology, vol. 76, no. 05, pp. 8–9, 2024

  20. [28]

    Enhancing energy efficiency in ai-powered data centers: Challenges and solutions,

    S. Shankar, “Enhancing energy efficiency in ai-powered data centers: Challenges and solutions,”Marine Biology Research at Bahamas, p. 93, 2024

  21. [29]

    Piezotronic effect in a normally off p-gan/algan/gan hemt toward highly sensitive pressure sensor,

    H.-Q. Nguyen, T. Nguyen, P. Tanner, T.-K. Nguyen, A. R. M. Foisal, J. Fastier-Wooller, T.-H. Nguyen, H.-P. Phan, N.-T. Nguyen, and D. V . Dao, “Piezotronic effect in a normally off p-gan/algan/gan hemt toward highly sensitive pressure sensor,”Applied Physics Letters, vol. 118,...

  22. [30]

    Ridge-channel algan/gan normally- off high-electron mobility transistor based on epitaxial lateral overgrowth,

    X. Ji, A. Fariza, J. Zhao, M. Wang, J. Wang, F. Yang, J. Li, and T. Wei, “Ridge-channel algan/gan normally- off high-electron mobility transistor based on epitaxial lateral overgrowth,”Semiconductor Science and Tech- nology, vol. 36, no. 7, p. 075003, 2021

  23. [31]

    Research on a high-threshold-voltage algan/gan hemt with p-gan cap and recessed gate in combination with graded algan barrier layer: Z. chen et al

    Z. Chen, L. Cai, K. Niu, C. Xu, H. Lin, P. Ren, D. Sun, and H. Lin, “Research on a high-threshold-voltage algan/gan hemt with p-gan cap and recessed gate in combination with graded algan barrier layer: Z. chen et al.”Journal of Electronic Materials, vol. 53, no. 5, pp. 2533–2543, 2024

  24. [32]

    Charging effect by fluorine-treatment and recess gate for enhancement-mode on algan/gan high electron mobility transistors,

    S. C. Kang, H.-W. Jung, S.-J. Chang, S. M. Kim, S. K. Lee, B. H. Lee, H. Kim, Y .-S. Noh, S.-H. Lee, S.-I. Kim et al., “Charging effect by fluorine-treatment and recess gate for enhancement-mode on algan/gan high electron mobility transistors,”Nanomaterials, vol. 10, no. 11, p...

  25. [33]

    1.3 kv vertical gan-based trench mosfets on 4-inch free standing gan wafer,

    W. He, J. Li, Z. Liao, F. Lin, J. Wu, B. Wang, M. Wang, N. Liu, H.-C. Chiu, H.-C. Kuoet al., “1.3 kv vertical gan-based trench mosfets on 4-inch free standing gan wafer,”Nanoscale Research Letters, vol. 17, no. 1, p. 14, 2022

  26. [34]

    1.7-kv vertical gan pn diode with triple-zone graded junction termination extension formed by ion-implantation,

    Y . Duan, J. Wang, A. Xie, Z. Zhu, and P. Fay, “1.7-kv vertical gan pn diode with triple-zone graded junction termination extension formed by ion-implantation,”e- Prime-Advances in Electrical Engineering, Electronics and Energy, vol. 6, p. 100330, 2023

  27. [35]

    Vertical gan trench-mosfets fabricated on ammonothermally grown bulk gan substrates,

    M. Kami ´nski, A. Taube, J. Tarenko, O. Sadowski, E. Brzozowski, J. Wierzbicka, M. Zadura, M. Ekielski, K. Kosiel, J. Jankowska- ´Sliwi´nskaet al., “Vertical gan trench-mosfets fabricated on ammonothermally grown bulk gan substrates,”physica status solidi (a), vol. 221, no. 21...

  28. [36]

    Low leakage fully-vertical gan-on-si power mosfets,

    Y . Ma, H. Chen, S. Zhang, H. Duan, B. Hu, H. Ma, J. Rao, and C. Liu, “Low leakage fully-vertical gan-on-si power mosfets,”Applied Physics Letters, vol. 127, no. 5, 2025

  29. [37]

    Review on main gate characteristics of p-type gan gate high-electron-mobility transistors,

    Z. Wang, J. Nan, Z. Tian, P. Liu, Y . Wu, and J. Zhang, “Review on main gate characteristics of p-type gan gate high-electron-mobility transistors,”Micromachines, vol. 15, no. 1, p. 80, 2023

  30. [38]

    Stability, reliability, and robustness of gan power devices: A re- view,

    J. P. Kozak, R. Zhang, M. Porter, Q. Song, J. Liu, B. Wang, R. Wang, W. Saito, and Y . Zhang, “Stability, reliability, and robustness of gan power devices: A re- view,”IEEE Transactions on Power Electronics, vol. 38, no. 7, pp. 8442–8471, 2023

  31. [39]

    Review of isolated dc-dc converters for applications in data center power delivery,

    S. Rahman, H. Shehada, and I. A. Khan, “Review of isolated dc-dc converters for applications in data center power delivery,” in2023 IEEE Texas Power and Energy Conference (TPEC). IEEE, 2023, pp. 1–6

  32. [40]

    Open rack v3 it gear 48v input connector, rev. 1.6,

    Open Compute Project, “Open rack v3 it gear 48v input connector, rev. 1.6,” Open Compute Project, Technical Specification Rev. 1.6, Sep. 2022, published 29 September 2022. [Online]. Available: https://bit.ly/40N0xKk

  33. [41]

    Ocp orv3 power solutions guide,

    TE Connectivity, “Ocp orv3 power solutions guide,” TE Connectivity, Technical Guide, May 2023, guide for Open Compute Project Open Rack V3 power solutions (10 pages). [Online]. Available: https://bit.ly/3MWUakE

  34. [42]

    A novel digital control strategy for gan-based interleaving crm totem- pole pfc,

    W. Yu, X. Fan, T. Wei, and Y . Xu, “A novel digital control strategy for gan-based interleaving crm totem- pole pfc,” in2024 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE, 2024, pp. 2831–2836

  35. [43]

    Gs-evb-btp-3kw-gs evaluation board technical documentation,

    Infineon Technologies AG, “Gs-evb-btp-3kw-gs evaluation board technical documentation,” Infineon Technologies AG, Evaluation Board / Technical Manual, 2024, 3 kW High-Efficiency Bridgeless Totem Pole PFC evaluation board (CoolGaN family) and supporting technical manual. [Onlin...

  36. [44]

    Wide bandgap power conversion – part 3: Isop llc converter,

    A. Pozo, M. de Rooij, and M. Palma, “Wide bandgap power conversion – part 3: Isop llc converter,” Efficient Power Conversion (EPC), Technical Article, Sep. 2025, published 28 September 2025 as part of Bodo’s Power Systems series. [Online]. Available: https://epc-co.com/ epc/po...

  37. [45]

    Gan based high-density unregulated 48 v to x v llc converters with??? 98% efficiency for future data centers,

    M. H. Ahmed, F. C. Lee, Q. Li, M. de Rooij, and D. Reusch, “Gan based high-density unregulated 48 v to x v llc converters with??? 98% efficiency for future data centers,” inPCIM Europe 2019; International Exhi- bition and Conference for Power Electronics, Intelligent Motion, R...

  38. [46]

    Lego-pol: A 48v-1.5 v 300a merged-two-stage hybrid converter for ultra-high-current microprocessors,

    J. Baek, P. Wang, Y . Elasser, Y . Chen, S. Jiang, and M. Chen, “Lego-pol: A 48v-1.5 v 300a merged-two-stage hybrid converter for ultra-high-current microprocessors,” in2020 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2020, pp. 490–497

  39. [47]

    2024 united states data center energy usage report,

    A. Shehabi, A. Newkirk, S. J. Smith, A. Hubbard, N. Lei, M. A. B. Siddik, B. Holecek, J. Koomey, E. Masanet, and D. Sartor, “2024 united states data center energy usage report,” 2024

  40. [48]

    Uptime institute global data center survey 2024,

    Uptime Institute, “Uptime institute global data center survey 2024,” Uptime Institute, Technical Report UII Keynote Report 146M, Jul. 2024, findings highlight resiliency, sustainability, efficiency, staffing, cloud, and AI trends among data center owners and operators. [Online...

  41. [49]

    Data Center Power Equipment Thermal Guidelines and Best Practices,

    ASHRAE Technical Committee 9.9, “Data Center Power Equipment Thermal Guidelines and Best Practices,” ASHRAE, White Paper, Jun. 2016, revised 22 June 2016; thermal guidelines for data center power equipment. [Online]. Available: https://www.ashrae.org/file%20library/technical% ...

  42. [50]

    Design of a gan totem-pole pfc converter using dc-link voltage control strategy for data center applications,

    J.-Y . Lee, J.-H. Chen, and K.-Y . Lo, “Design of a gan totem-pole pfc converter using dc-link voltage control strategy for data center applications,”IEEE Access, vol. 10, pp. 50 278–50 287, 2022

  43. [51]

    Current status and future trends of gan hemts in electrified transportation,

    N. Keshmiri, D. Wang, B. Agrawal, R. Hou, and A. Emadi, “Current status and future trends of gan hemts in electrified transportation,”IEEE access, vol. 8, pp. 70 553–70 571, 2020

  44. [52]

    Evaluation of gan power transistor switching performance on charac- teristics of bidirectional dc-dc converter,

    M. Frivaldsky, J. Morgos, and R. Zelnik, “Evaluation of gan power transistor switching performance on charac- teristics of bidirectional dc-dc converter,”Elektronika ir elektrotechnika, vol. 26, no. 4, pp. 18–24, 2020

  45. [53]

    Design and comparative analysis of an ultra-highly efficient, compact half-bridge llc resonant gan converter for low-power applications,

    M. Faizan, X. Wang, and M. Z. Yousaf, “Design and comparative analysis of an ultra-highly efficient, compact half-bridge llc resonant gan converter for low-power applications,”Electronics, vol. 12, no. 13, p. 2850, 2023

  46. [54]

    Review and outlook on gan and sic power devices: Industrial state-of-the-art, applications, and perspectives,

    M. Buffolo, D. Favero, A. Marcuzzi, C. De Santi, G. Meneghesso, E. Zanoni, and M. Meneghini, “Review and outlook on gan and sic power devices: Industrial state-of-the-art, applications, and perspectives,”IEEE Transactions on Electron Devices, vol. 71, no. 3, pp. 1344–1355, 2024

  47. [55]

    Wide-bandgap semiconductors: a critical analysis of gan, sic, algan, diamond, and ga2o3 synthesis methods, challenges, and prospective technological innovations,

    L. A. Yeboah, A. Abdul Malik, P. A. Oppong, P. S. Acheampong, J. A. Morgan, R. A. A. Addo, B. Williams Henyo, S. T. Taylor, W. M. Zudor, and S. Osei-Amponsah, “Wide-bandgap semiconductors: a critical analysis of gan, sic, algan, diamond, and ga2o3 synthesis methods, challenges...

  48. [56]

    Optimal design of gan hemt based high efficiency llc converter,

    B. Zhang, M. Zhao, P. Huang, and Q. Wang, “Optimal design of gan hemt based high efficiency llc converter,” Energy Reports, vol. 8, pp. 1181–1190, 2022

  49. [57]

    Thermal management of wide-bandgap power semiconductors: Strategies and challenges in sic and gan power devices,

    G. Han, J. Kim, S. Park, and W. Bae, “Thermal management of wide-bandgap power semiconductors: Strategies and challenges in sic and gan power devices,” Electronics, vol. 14, no. 21, p. 4193, 2025

  50. [58]

    Cascode gan hemt gate driving analysis,

    V . Heumesser, J.-S. Lai, H.-C. Hsieh, J. Hsu, C.-Y . Yang, E. Y . Chang, C.-Y . Liu, W.-H. Chieng, and Y .-T. Hsieh, “Cascode gan hemt gate driving analysis,” in 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia). IEEE, 2023, pp. 1–6

  51. [59]

    Cmos active gate driver for closed-loop dv/dt control of gan transistors,

    P. Bau, M. Cousineau, B. Cougo, F. Richardeau, and N. Rouger, “Cmos active gate driver for closed-loop dv/dt control of gan transistors,”IEEE Transactions on Power Electronics, vol. 35, no. 12, pp. 13 322–13 332, 2020

  52. [60]

    Gan-based matrix converter design with output filters for motor friendly drive system,

    H. Bu and Y . Cho, “Gan-based matrix converter design with output filters for motor friendly drive system,” Energies, vol. 13, no. 4, p. 971, 2020

  53. [61]

    Design and application of high-efficiency gallium nitride (gan)-based power electronic devices,

    C. Lu, “Design and application of high-efficiency gallium nitride (gan)-based power electronic devices,”Applied and Computational Engineering, vol. 153, no. 1, pp. 90–95, 2025

  54. [62]

    (n.d.) Silicon wafers

    UniversityWafer, Inc. (n.d.) Silicon wafers. Accessed: 2026-03-03. [Online]. Available: https: //www.universitywafer.com/silicon_wafers.html

  55. [63]

    (n.d.) Gallium nitride on silicon epitaxial wafers

    ——. (n.d.) Gallium nitride on silicon epitaxial wafers. Accessed: 2026-03-03. [On- line]. Available: https://www.universitywafer.com/ gallium-nitride-on-silicon-epitaxy-wafer.html

  56. [64]

    (n.d.) Rf gan substrate wafers for gan-on-si applications

    Okmetic. (n.d.) Rf gan substrate wafers for gan-on-si applications. Accessed: 2026-03-03. [Online]. Available: https://www.okmetic.com/ silicon-wafers/rfsi-wafers-high-resistivity-line-for-rf/ rf-gan-substrate-wafers/

  57. [65]

    (2025, Jul.) Navitas announces plans for 200mm gan production with psmc

    Navitas Semiconductor. (2025, Jul.) Navitas announces plans for 200mm gan production with psmc. Accessed: 2026-03-03. [Online]. Available: https://bit.ly/4bmGOHy

  58. [66]

    (2025, Sep.) X-fab now offers gan-on-si foundry services

    X-FAB Silicon Foundries SE. (2025, Sep.) X-fab now offers gan-on-si foundry services. Accessed: 2026-03-03. [Online]. Available: https://www.xfab.com/news/details/ article/x-fab-now-offers-gan-on-si-foundry-services

  59. [67]

    (n.d.) Gallium nitride (gan) technology

    Infineon Technologies AG. (n.d.) Gallium nitride (gan) technology. Accessed: 2026-03-03. [On- line]. Available: https://www.infineon.com/technology/ gallium-nitride-gan

  60. [68]

    (2024, Sep.) Infineon pioneers world’s first 300 mm power gallium nitride (gan) technology

    ——. (2024, Sep.) Infineon pioneers world’s first 300 mm power gallium nitride (gan) technology. Accessed: 2026-03-03. [Online]. Available: https://www.infineon. com/press-release/2024/infxx202409-142

  61. [69]

    Gs66508t: 650 v enhancement mode gan transistor datasheet, rev. 200402,

    GaN Systems Inc., “Gs66508t: 650 v enhancement mode gan transistor datasheet, rev. 200402,” 2020, accessed: 2026-03-03. [Online]. Available: https://www.mouser. com/datasheet/3/70/1/GS66508T-DS-Rev-200402.pdf

  62. [70]

    Silicon carbide (sic) materials,

    Coherent Corp., “Silicon carbide (sic) materials,” Coherent Corp., Datasheet, n.d., accessed: 2026-03-

  63. [71]

    Available: https://www.coherent.com/ resources/datasheet/materials/sic-materials-ds.pdf

    [Online]. Available: https://www.coherent.com/ resources/datasheet/materials/sic-materials-ds.pdf

  64. [72]

    (2025) Sic raw materials see a price increase while 6-inch substrate kicks off a price war

    TrendForce. (2025) Sic raw materials see a price increase while 6-inch substrate kicks off a price war. TrendForce. Accessed: 2026-03-03. [Online]. Available: https://bit.ly/4aNZCzj

  65. [73]

    (n.d.) Silicon carbide: The facts

    Navitas Semiconductor. (n.d.) Silicon carbide: The facts. Navitas Semiconductor. Accessed: 2026- 03-03. [Online]. Available: https://navitassemi.com/ silicon-carbide-the-facts/

  66. [74]

    (2025) Silicon carbide (sic) wafer market size, share and trend analysis, forecast 2025–2032

    Navistrat Analytics. (2025) Silicon carbide (sic) wafer market size, share and trend analysis, forecast 2025–2032. Navistrat Analytics. Report code: NA_01409. Accessed: 2026-03-03. [Online]. Available: https://navistratanalytics.com/report_store/ silicon-carbide-sic-wafer-market/

  67. [75]

    Development of non-core 4-inch gan substrate,

    H. Osada, Y . Yoshizumi, K. Uematsu, S. Minobe, F. Sato, F. Nakanisihi, Y . Yamamoto, Y . Hagi, and Y . Yabuhara, “Development of non-core 4-inch gan substrate,” inProc. Int. Conf. Compound Semiconductor Manufacturing Technology, 2017, pp. 16–4

  68. [76]

    Bulk gallium nitride (gan) wafers for research and production,

    UniversityWafer, Inc., “Bulk gallium nitride (gan) wafers for research and production,” n.d., accessed: 2026-03-03. [Online]. Available: https://www.universitywafer.com/ bulk-gan.html

  69. [77]

    4 inch research grade 0.4 mm free standing gan wafer for semiconductors,

    Sapphire-Substrate.com, “4 inch research grade 0.4 mm free standing gan wafer for semiconductors,” n.d., accessed: 2026-03-03. [Online]. Available: https: //bit.ly/4aQ1MOU

  70. [78]

    Bulk gan substrate market growing at 10% cagr to $100m in 2022, from 60,000 wafers in 2016,

    “Bulk gan substrate market growing at 10% cagr to $100m in 2022, from 60,000 wafers in 2016,”semiconductorTODAY Compounds & Advanced Silicon, vol. 12, no. 2, March/April 2017, market focus: GaN materials. [Online]. Avail- able: https://www.semiconductor-today.com/features/ PDF...

  71. [79]

    Gallium nitride substrate costs to plummet by 60 percent,

    “Gallium nitride substrate costs to plummet by 60 percent,”Compound Semiconductor, Nov. 2012, accessed: 2026-03-03. [Online]. Available: https: //compoundsemiconductor.net/article/90117/Gallium_ nitride_substrate_costs_to_plummet_by_60_percent

  72. [80]

    Gallium,

    U.S. Geological Survey, “Gallium,” U.S. Geological Survey, Tech. Rep., Jan. 2025, in: Mineral Commodity Summaries 2025. [Online]. Available: https://pubs.usgs. gov/periodicals/mcs2025/mcs2025-gallium.pdf

  73. [81]

    Gallium,

    ——, “Gallium,” U.S. Geological Survey, Reston, V A, Tech. Rep. 2026, 2026, in: Mineral Commodity Summaries 2026. [Online]. Available: https://pubs.usgs. gov/periodicals/mcs2026/mcs2026-gallium.pdf

  74. [82]

    The mineral industry of china,

    J. W. Moon, “The mineral industry of china,” U.S. Geological Survey, Reston, V A, Tech. Rep. Area Reports—International, 2026, 2023 Minerals Yearbook, advance release. [Online]. Available: https: //pubs.usgs.gov/myb/vol3/2023/myb3-2023-china.pdf

  75. [83]

    Material compatibility,

    Cornell NanoScale Science & Technology Facility, “Material compatibility,” https://www.cnf.cornell.edu/ equipment/compatibility, n.d., accessed: 2026-03-03

  76. [84]

    High precision, high durability, low cost bead dishes,

    TANAKA Precious Metals, “High precision, high durability, low cost bead dishes,” https: //tanaka-preciousmetals.com/en/solution/case/case13/, n.d., accessed: 2026-03-03

  77. [85]

    The great debate: Copper vs. gold ball bonding,

    C. Breach, “The great debate: Copper vs. gold ball bonding,”Semiconductor Digest, October 2008, accessed: 2026-03-03. [Online]. Available: https://sst.semiconductor-digest.com/2008/ 10/the-great-debate-copper-vs-gold-ball-bonding/

  78. [86]

    Gallium nitride transistor packaging advances and thermal modeling,

    J. Strydom, M. de Rooij, and A. Lidow, “Gallium nitride transistor packaging advances and thermal modeling,” EDN China, pp. 1–13, 2012

  79. [87]

    Effectively paralleling enhancement mode gallium nitride transistors for high current and high frequency applications,

    D. Reusch and J. Strydom, “Effectively paralleling enhancement mode gallium nitride transistors for high current and high frequency applications,” Efficient Power Conversion Corporation (EPC), Application Note AN020, May 2013, accessed: 2026-03-03. [Online]. Available: https:/...

  80. [88]

    Lmg3522r030-q1 650-v 30-m ω gan fet with integrated driver, protection, and temperature reporting,

    Texas Instruments, “Lmg3522r030-q1 650-v 30-m ω gan fet with integrated driver, protection, and temperature reporting,” 2024, rev. D datasheet. [Online]. Available: https://www.ti.com/lit/ds/symlink/lmg3522r030-q1.pdf

  81. [89]

    Igt65r055d2 coolgan™ g5 650 v enhancement-mode power transistor,

    Infineon Technologies AG, “Igt65r055d2 coolgan™ g5 650 v enhancement-mode power transistor,” 2024, datasheet, Revision 0.1. [Online]. Available: https://www.infineon.com/assets/row/public/documents/ 24/49/infineon-igt65r055d2-datasheet-en.pdf

  82. [90]

    Die attach materials for power electronics in electric vehicles 2020–2030,

    IDTechEx, “Die attach materials for power electronics in electric vehicles 2020–2030,” 2020, market research report. [Online]. Available: https://bit.ly/4b4E3JC

  83. [91]

    (2026) Innoscience gan products break into google’s supply chain

    TrendForce. (2026) Innoscience gan products break into google’s supply chain. News article. [Online]. Available: https://bit.ly/3OEa5F0

  84. [92]

    Achieving gan products with lifetime reliability,

    Texas Instruments, “Achieving gan products with lifetime reliability,” Texas Instruments, White Paper SNOAA68, Jun. 2021, accessed: 2026-03-03. [Online]. Available: https://www.ti.com/lit/wp/snoaa68/snoaa68.pdf

  85. [93]

    Silicon heatwave: The looming change in data center climates,

    D. Bizo, “Silicon heatwave: The looming change in data center climates,” Uptime Institute Intelligence, UI Intelligence Report 74, Aug. 2022, accessed: 2026-03-03. [Online]. Available: https://bit.ly/46YmzxB

  86. [94]

    W. Runyon. (2023, Sep.) An industry’s journey to system-level predictive analytics for the data center starts now. Schneider Electric. Schneider Electric Blog. Accessed: 2026-03-03. [Online]. Available: https://bit.ly/4cmeWEw

  87. [95]

    Statistical interpretation of life test: Comparison between mil and jedec requirements,

    Y . Chen, “Statistical interpretation of life test: Comparison between mil and jedec requirements,” Presentation, NASA Electronic Parts and Packaging (NEPP) Electronics Technology Workshop (ETW), Jun. 2023, nASA Technical Reports Server Document ID: 20230009005. Accessed: 2026-03-

  88. [96]

    Available: https://nepp.nasa.gov/docs/etw/ 2023/15-JUN-THU/1000_Chen_20230009005.pdf

    [Online]. Available: https://nepp.nasa.gov/docs/etw/ 2023/15-JUN-THU/1000_Chen_20230009005.pdf

  89. [97]

    Automotive electronics reliability testing starts and ends with the mission profile,

    T. Eikenberg, “Automotive electronics reliability testing starts and ends with the mission profile,” Monolithic Power Systems, Tech. Rep. Article #0061, Rev. 1.0, May 2022, accessed: 2026-03-03. [Online]. Available: https: //media.monolithicpower.com/mps_cms_document/2/0/ 2020...

  90. [98]

    Search for new particles at the ilc,

    M. T. N. P. de Vera, “Search for new particles at the ilc,”arXiv preprint arXiv:2311.00525, 2023

  91. [99]

    Development of gan hemts fabricated on silicon, silicon-on-insulator, and engineered substrates and the heterogeneous integration,

    L.-H. Hsu, Y .-Y . Lai, P.-T. Tu, C. Langpoklakpam, Y .-T. Chang, Y .-W. Huang, W.-C. Lee, A.-J. Tzou, Y .-J. Cheng, C.-H. Linet al., “Development of gan hemts fabricated on silicon, silicon-on-insulator, and engineered substrates and the heterogeneous integration,” Micromachi...

  92. [100]

    Sic and gan devices–wide bandgap is not all the same,

    N. Kaminski and O. Hilt, “Sic and gan devices–wide bandgap is not all the same,”IET Circuits, Devices & Systems, vol. 8, no. 3, pp. 227–236, 2014

  93. [101]

    Sixteen years gan on si,

    A. Dadgar, “Sixteen years gan on si,”physica status solidi (b), vol. 252, no. 5, pp. 1063–1068, 2015

  94. [102]

    Method for inferring the mechanical strain of gan-on-si epitaxial layers using optical pro- filometry and finite element analysis,

    B. Spiridon, M. Toon, A. Hinz, S. Ghosh, S. Fairclough, B. Guilhabert, M. Strain, I. Watson, M. D. Dawson, D. Walliset al., “Method for inferring the mechanical strain of gan-on-si epitaxial layers using optical pro- filometry and finite element analysis,”Optical Materials Exp...

  95. [103]

    2- mm-gate-periphery gan high electron mobility transistor s on sic and si substrates: A comparative analysis from a small-signal standpoint,

    A. Jarndal, M. A. Alim, A. Raffo, and G. Crupi, “2- mm-gate-periphery gan high electron mobility transistor s on sic and si substrates: A comparative analysis from a small-signal standpoint,”International Journal of RF and Microwave Computer-Aided Engineering, vol. 31, no. 6, ...

  96. [104]

    Gan substrates for iii-nitride devices,

    T. Paskova, D. A. Hanser, and K. R. Evans, “Gan substrates for iii-nitride devices,”Proceedings of the IEEE, vol. 98, no. 7, pp. 1324–1338, 2009

  97. [105]

    Direct growth of wafer-scale self-separated gan on reusable 2d material substrates,

    C.-H. Huang, C.-Y . Wu, and Y .-C. Chou, “Direct growth of wafer-scale self-separated gan on reusable 2d material substrates,”Advanced Science, vol. 11, no. 41, p. 2406126, 2024

  98. [106]

    The evolution of manufacturing technology for gan electronic devices,

    A.-C. Liu, P.-T. Tu, C. Langpoklakpam, Y .-W. Huang, Y .-T. Chang, A.-J. Tzou, L.-H. Hsu, C.-H. Lin, H.-C. Kuo, and E. Y . Chang, “The evolution of manufacturing technology for gan electronic devices,”Micromachines, vol. 12, no. 7, p. 737, 2021

  99. [107]

    A review on the gan-on-si power electronic devices,

    Y . Zhong, J. Zhang, S. Wu, L. Jia, X. Yang, Y . Liu, Y . Zhang, and Q. Sun, “A review on the gan-on-si power electronic devices,”Fundamental Research, vol. 2, no. 3, pp. 462–475, 2022

  100. [108]

    Gallium nitride (gan) high-electron- mobility transistors with thick copper metallization featuring a power density of 8.2 w/mm for ka-band applications,

    Y . Lin, S. Chen, P. Lee, K. Lai, T. Huang, E. Y . Chang, and H.-T. Hsu, “Gallium nitride (gan) high-electron- mobility transistors with thick copper metallization featuring a power density of 8.2 w/mm for ka-band applications,”Micromachines, vol. 11, no. 2, p. 222, 2020

  101. [109]

    A fast- switching integrated full-bridge power module based on gan ehemt devices,

    A. B. Jørgensen, S. B˛ eczkowski, C. Uhrenfeldt, N. H. Petersen, S. Jørgensen, and S. Munk-Nielsen, “A fast- switching integrated full-bridge power module based on gan ehemt devices,”IEEE Transactions on Power Electronics, vol. 34, no. 3, pp. 2494–2504, 2018

  102. [110]

    Review of topside interconnections for wide bandgap power semiconductor packaging,

    L. Wang, W. Wang, R. J. Hueting, G. Rietveld, and J. A. Ferreira, “Review of topside interconnections for wide bandgap power semiconductor packaging,”IEEE Transactions on Power Electronics, vol. 38, no. 1, pp. 472–490, 2022

  103. [111]

    Effect of the heat dissipation system on hard-switching gan-based power converters for energy conversion,

    D. Lumbreras, M. Vilella, J. Zaragoza, N. Berbel, J. Jordà, and A. Collado, “Effect of the heat dissipation system on hard-switching gan-based power converters for energy conversion,”Energies, vol. 14, no. 19, p. 6287, 2021

  104. [112]

    Sta- tus of aluminum oxide gate dielectric technology for insulated-gate gan-based devices,

    A. Calzolaro, T. Mikolajick, and A. Wachowiak, “Sta- tus of aluminum oxide gate dielectric technology for insulated-gate gan-based devices,”Materials, vol. 15, no. 3, p. 791, 2022

  105. [113]

    Strategies for improving the sustainability of data centers via energy mix, energy conservation, and circular energy,

    M. Manganelli, A. Soldati, L. Martirano, and S. Ra- makrishna, “Strategies for improving the sustainability of data centers via energy mix, energy conservation, and circular energy,”Sustainability, vol. 13, no. 11, p. 6114, 2021

  106. [114]

    Increasing the energy efficiency of a data center based on machine learning,

    Z. Yang, J. Du, Y . Lin, Z. Du, L. Xia, Q. Zhao, and X. Guan, “Increasing the energy efficiency of a data center based on machine learning,”Journal of Industrial Ecology, vol. 26, no. 1, pp. 323–335, 2022

  107. [115]

    Geeco: Green data centers for energy optimization and carbon footprint reduction,

    S. Mondal, F. B. Faruk, D. Rajbongshi, M. M. K. Efaz, and M. M. Islam, “Geeco: Green data centers for energy optimization and carbon footprint reduction,” Sustainability, vol. 15, no. 21, p. 15249, 2023

  108. [116]

    Chasing carbon: The elusive environmental footprint of computing,

    U. Gupta, Y . G. Kim, S. Lee, J. Tse, H.-H. S. Lee, G.-Y . Wei, D. Brooks, and C.-J. Wu, “Chasing carbon: The elusive environmental footprint of computing,” in2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA). IEEE, 2021, pp. 854– 867

  109. [117]

    x pue: Extending power usage effectiveness metrics for cloud infrastruc- tures,

    G. Fieni, R. Rouvoy, and L. Seinturier, “x pue: Extending power usage effectiveness metrics for cloud infrastruc- tures,”IEEE Transactions on Sustainable Computing, 2025

  110. [118]

    Carbon emission modeling for high-performance computing-based ai in new power systems with large-scale renewable energy integration,

    H. Liu and J. Zhai, “Carbon emission modeling for high-performance computing-based ai in new power systems with large-scale renewable energy integration,” Processes, vol. 13, no. 2, p. 595, 2025

  111. [119]

    Toward sustainable hpc: Carbon foot- print estimation and environmental implications of hpc systems,

    B. Li, R. Basu Roy, D. Wang, S. Samsi, V . Gadepally, and D. Tiwari, “Toward sustainable hpc: Carbon foot- print estimation and environmental implications of hpc systems,” inProceedings of the international conference for high performance computing, networking, storage and ana...

  112. [120]

    How highly efficient power electronics transfers high electrocaloric material performance to heat pump systems: S. mönch et al

    S. Mönch, R. Reiner, P. Waltereit, M. Basler, R. Quay, S. Gebhardt, C. Molin, D. Bach, R. Binninger, and K. Bartholomé, “How highly efficient power electronics transfers high electrocaloric material performance to heat pump systems: S. mönch et al.”MRS advances, vol. 8, no. 15...

  113. [121]

    Eval- uating of dc-dc buck-boost converter implementation for integrated solar photovoltaic and thermoelectric cooler system,

    P. A. Sesotyo, T. D. Cahyono, E. Sadewaet al., “Eval- uating of dc-dc buck-boost converter implementation for integrated solar photovoltaic and thermoelectric cooler system,”International Journal of Engineering Continuity, vol. 4, no. 1, pp. 140–172, 2025

  114. [122]

    Modeling of thermoelectric converter char- acteristics: Lecture at the summer thermoelectric school, june 30, 2024, krakow, poland,

    L. Vikhor, “Modeling of thermoelectric converter char- acteristics: Lecture at the summer thermoelectric school, june 30, 2024, krakow, poland,”Journal of Thermoelec- tricity, no. 3, pp. 5–22, 2024

  115. [123]

    Techno- economic assessment of cascade air-to-water heat pump retrofitted into residential buildings using experimentally validated simulations,

    K. X. Le, M. J. Huang, N. N. Shah, C. Wilson, P. Mac Artain, R. Byrne, and N. J. Hewitt, “Techno- economic assessment of cascade air-to-water heat pump retrofitted into residential buildings using experimentally validated simulations,”Applied Energy, vol. 250, pp. 633–652, 2019

  116. [124]

    Design of a 2.5 kw four- level interleaved flying capacitor multilevel totem-pole pfc converter with ac-side passive volume optimization,

    N. Ishraq and A. Mallik, “Design of a 2.5 kw four- level interleaved flying capacitor multilevel totem-pole pfc converter with ac-side passive volume optimization,” IEEE Open Journal of Power Electronics, vol. 5, pp. 214–231, 2024

  117. [125]

    Mitigation of current distortion for gan-based crm totem-pole pfc rectifier with zvs control,

    J. Sun, H. Gui, J. Li, X. Huang, N. Strain, D. J. Costinett, and L. M. Tolbert, “Mitigation of current distortion for gan-based crm totem-pole pfc rectifier with zvs control,” IEEE Open Journal of Power Electronics, vol. 2, pp. 290–303, 2021

  118. [126]

    Design and fabrication of an isolated two-stage ac–dc power supply with a 99.50% pf and zvs for high-power density industrial applications,

    A. H. Okilly and J. Baek, “Design and fabrication of an isolated two-stage ac–dc power supply with a 99.50% pf and zvs for high-power density industrial applications,” Electronics, vol. 11, no. 12, p. 1898, 2022

  119. [127]

    Application of gan devices for 1 kw server power supply with integrated magnetics,

    F. C. Lee, Q. Li, Z. Liu, Y . Yang, C. Fei, and M. Mu, “Application of gan devices for 1 kw server power supply with integrated magnetics,”CPSS Transactions on power electronics and applications, vol. 1, no. 1, pp. 3–12, 2016

  120. [128]

    Multicell power supplies for improved energy efficiency in the information and communications technology infrastructures,

    M. Chrysostomou, N. Christofides, S. Ioannou, and A. Polycarpou, “Multicell power supplies for improved energy efficiency in the information and communications technology infrastructures,”Energies, vol. 14, no. 21, p. 7038, 2021

  121. [129]

    System optimiza- tion of a high power density non-isolated intermediate bus converter for 48 v server applications,

    D. Reusch, S. Biswas, and Y . Zhang, “System optimiza- tion of a high power density non-isolated intermediate bus converter for 48 v server applications,”IEEE Transactions on Industry Applications, vol. 55, no. 2, pp. 1619–1627, 2018

  122. [130]

    Two-stage 48-v vrm with intermediate bus voltage optimization for data centers,

    M. H. Ahmed, F. C. Lee, and Q. Li, “Two-stage 48-v vrm with intermediate bus voltage optimization for data centers,”IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 9, no. 1, pp. 702–715, 2020

  123. [131]

    Extreme efficiency 240 vac to load data center power delivery topologies and control,

    R. Pilawa-Podgurski, “Extreme efficiency 240 vac to load data center power delivery topologies and control,” University of California, Berkeley, CA (United States), Tech. Rep., 2024

  124. [132]

    Cooling technologies for internet data center in china: Principle, energy efficiency, and applications,

    X. Huang, J. Yan, X. Zhou, Y . Wu, and S. Hu, “Cooling technologies for internet data center in china: Principle, energy efficiency, and applications,”Energies, vol. 16, no. 20, p. 7158, 2023

  125. [133]

    Optimization control strategies and evaluation metrics of cooling systems in data centers: a review,

    Q. Chang, Y . Huang, K. Liu, X. Xu, Y . Zhao, and S. Pan, “Optimization control strategies and evaluation metrics of cooling systems in data centers: a review,”Sustainability, vol. 16, no. 16, p. 7222, 2024

  126. [134]

    A 3 kw gan hemt based three-phase converter achieving a switching frequency of 300 khz and an efficiency of 97.06%,

    Z. Wang, F. Ye, S. Duan, X. Yuan, D. Zuo, Y . Zhang, K. Wang, and Y . Li, “A 3 kw gan hemt based three-phase converter achieving a switching frequency of 300 khz and an efficiency of 97.06%,”IEEE Access, vol. 12, pp. 116 442–116 456, 2024

  127. [135]

    A survey of conductive and radiated emi reduction techniques in power electronics converters across wide-bandgap devices,

    C. Li, Q. Ma, Y . Tong, J. Wang, and P. Xu, “A survey of conductive and radiated emi reduction techniques in power electronics converters across wide-bandgap devices,”IET Power Electronics, vol. 16, no. 13, pp. 2121–2137, 2023

  128. [136]

    Mitigating emi noise in propagation paths: Review of parasitic and coupling effects in power electronic packages, filters, and systems,

    N. Jia, L. Xue, and H. Cui, “Mitigating emi noise in propagation paths: Review of parasitic and coupling effects in power electronic packages, filters, and systems,” IEEE Open Journal of Power Electronics, vol. 5, pp. 352–368, 2024

  129. [137]

    99% efficient 10 kv sic-based 7 kv/400 v dc transformer for future data centers,

    D. Rothmund, T. Guillod, D. Bortis, and J. W. Kolar, “99% efficient 10 kv sic-based 7 kv/400 v dc transformer for future data centers,”IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 7, no. 2, pp. 753–767, 2018

  130. [138]

    Leveraging gan for dc-dc power modules for efficient evs: A review,

    P. Prajapati and S. Balamurugan, “Leveraging gan for dc-dc power modules for efficient evs: A review,”IEEE Access, vol. 11, pp. 95 874–95 888, 2023

  131. [139]

    Research of pcb parasitic inductance in the gan transistor power loop,

    B. Sun, Z. Zhang, and M. A. Andersen, “Research of pcb parasitic inductance in the gan transistor power loop,” in 2019 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia). IEEE, 2019, pp. 1–5

  132. [140]

    Emi mitigation of gan power inverter leg by local shielding techniques,

    P. B. Derkacz, J.-L. Schanen, P.-O. Jeannin, P. J. Chrzan, P. Musznicki, and M. Petit, “Emi mitigation of gan power inverter leg by local shielding techniques,”IEEE Transactions on Power Electronics, vol. 37, no. 10, pp. 11 996–12 004, 2022

  133. [141]

    Challenges for large-scale deployment of wbg in power electronics,

    H. Lavri ˇc, P. Zajec, K. Drobni ˇc, A. Rihar, V . Ambrožiˇc, D. V onˇcina, and M. Nemec, “Challenges for large-scale deployment of wbg in power electronics,”Informacije MIDEM, vol. 55, no. 1, pp. 3–24, 2025

  134. [142]

    Thermal management and packaging of wide and ultra- wide bandgap power devices: a review and perspective,

    Y . Qin, B. Albano, J. Spencer, J. S. Lundh, B. Wang, C. Buttay, M. Tadjer, C. DiMarino, and Y . Zhang, “Thermal management and packaging of wide and ultra- wide bandgap power devices: a review and perspective,” Journal of physics D: applied physics, vol. 56, no. 9, p. 093001, 2023

  135. [143]

    Guide- line for switching reliability evaluation procedures for gallium nitride power conversion devices,

    JEDEC Solid State Technology Association, “Guide- line for switching reliability evaluation procedures for gallium nitride power conversion devices,” JEDEC Solid State Technology Association, JEDEC Publication JEP180.01, Jan. 2021

  136. [144]

    Stability, reliability, and robustness of GaN power devices: A re- view,

    J. P. Kozak, R. Zhang, M. Porter, Q. Song, J. Liu, B. Wang, R. Wang, W. Saito, and Y . Zhang, “Stability, reliability, and robustness of GaN power devices: A re- view,”IEEE Transactions on Power Electronics, vol. 38, no. 7, pp. 8442–8471, Jul. 2023

  137. [145]

    Dynamic high temperature operating life test methodology for long-term switching reliability of GaN power devices,

    M. F. Tayyab and T. Basler, “Dynamic high temperature operating life test methodology for long-term switching reliability of GaN power devices,”Microelectronics Reliability, vol. 138, p. 114613, Nov. 2022

  138. [146]

    F. Rauf, M. F. Tayyab, S. Mouhoubi, M. L. Heldwein, and G. Curatola, “Investigation of the long-term dynamic RDS(on) variation and dynamic high temperature oper- ating life test robustness of Schottky-gate and ohmic- gate GaN HEMT with comparable stress conditions,” Microelect...

  139. [147]

    A study on the dynamic switching characteristics of p-GaN HEMT power de- vices,

    C. Fan, H. Zhang, H. Liu, X. Pan, S. Yan, H. Chen, W. Guo, L. Cai, and S. Wei, “A study on the dynamic switching characteristics of p-GaN HEMT power de- vices,”Micromachines, vol. 15, no. 8, p. 993, Jul. 2024

  140. [148]

    Challenges and perspectives for vertical gan-on-si trench mos reliability: From leakage current analysis to gate stack optimization,

    K. Mukherjee, C. De Santi, M. Borga, K. Geens, S. You, B. Bakeroot, S. Decoutere, P. Diehle, S. Hübner, F. Altmannet al., “Challenges and perspectives for vertical gan-on-si trench mos reliability: From leakage current analysis to gate stack optimization,”Materials, vol. 14, n...

  141. [149]

    Advanced packaging technology of gan hemt module for high-power and high-frequency applications: a review,

    M. Wang, P. Gao, F. Shi, W. Hu, X. Wang, H. Yan, and Y . Mei, “Advanced packaging technology of gan hemt module for high-power and high-frequency applications: a review,”IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 9, pp. 1537– 1550, 2024

  142. [150]

    Power module design for gan transistors enabling high switching speed in multi-kilowatt applications,

    D. Wöhrle, B. Burger, and O. Ambacher, “Power module design for gan transistors enabling high switching speed in multi-kilowatt applications,”Energy Technology, vol. 11, no. 12, p. 2300460, 2023

  143. [151]

    Thermal cycling characterization of an integrated low-inductance gan ehemt power module,

    Z. Sun, M. Takahashi, W. Guo, S. Munk-Nielsen, and A. B. Jørgensen, “Thermal cycling characterization of an integrated low-inductance gan ehemt power module,” Microelectronics Reliability, vol. 161, p. 115482, 2024

  144. [152]

    Enhancing supply resilience for critical materials: Case study of gallium supply in the united states,

    J. Wesselkaemper, A. C. Newkirk, T. P. Hendrickson, N. Helal, P. Rao, S. J. Smith, and A. Z. Haddad, “Enhancing supply resilience for critical materials: Case study of gallium supply in the united states,”Resources, Conservation and Recycling, vol. 222, p. 108436, 2025

Pith tools

Reviewed June 25, 2026 · model on record in the stance chip above.