Pith Number

pith:VFDXE5FX

pith:2026:VFDXE5FXCRLZ5VUT76G656MCMV

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Development of Small-pitch, Ultra-thin 3D Silicon Sensors at USTC

Chuan Liao, De Zhang, Han Li, Jinlan Peng, Kuo Ma, Manwen Liu, Shengjia He, Tian-ao Wang, Wenhua Shi, Xiang Li, Xiuxia Wang, Yanwen Liu, Yu Nie, Zebo Tang, Zheng Li, Zheng Liang

Ultra-thin 3D silicon sensors with 50-micron active layers and 25-micron pixels are designed for single-pixel position and timing measurements.

arxiv:2605.13281 v1 · 2026-05-13 · physics.ins-det

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Claims

C1strongest claim

The sensor involves columnar electrodes (5 um in diameter) of both doping types, etched from the same wafer side. The p+ electrodes pass through the epitaxial wafer, whereas the n+ electrodes stop at a short distance from the opposite side of the epitaxial wafer. With respect to previous generations of 3D sensors, they feature an ultra-thin active substrate (50 um) and a small pixel size of 50 um x 50 um or 25 um x 25 um. This R&D project aims to establish a sensor technology to simultaneously measure position and time information at the single-pixel level.

C2weakest assumption

That the fabricated sensors with the described electrode geometry and 50 um thickness will actually achieve simultaneous position and timing resolution at the single-pixel level once characterized, as the abstract states the first run is complete but provides no performance data.

C3one line summary

USTC produced ultra-thin 3D silicon pixel sensors with small pitches for simultaneous single-pixel position and timing measurements.

References

15 extracted · 15 resolved · 0 Pith anchors

[1] Da Via, et al., 3D silicon sensors: Design, large area production and quality assurance for the ATLAS IBL pixel detector upgrade, Nucl 2012 · doi:10.1016/j.nima.2012.07

[2] Likelihood methods for CMB experiments 2021 · doi:10.3389/fphy

[3] Pattern Recognition 127 (2022), 108611 2019 · doi:10.1016/j

[4] Diehl, et al., Evaluation of 3D sensors for fast timing applications, Nucl.Instrum.Meth.A1065(2024)169517.doi:10.1016/j.nima.2024 2024 · doi:10.1016/j.nima.2024

[5] Parker, et al., Increased Speed: 3D Silicon Sensors; Fast Current Amplifiers, IEEE Trans 2011

Formal links

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Receipt and verification

First computed	2026-05-18T02:44:49.193536Z
Builder	pith-number-builder-2026-05-17-v1
Signature	Pith Ed25519 (`pith-v1-2026-05`) · public key
Schema	pith-number/v1.0

Canonical hash

a9477274b714579ed693ff8deef982657715cba9b96f5513331da07d5ce22ada

Aliases

arxiv: 2605.13281 · arxiv_version: 2605.13281v1 · doi: 10.48550/arxiv.2605.13281 · pith_short_12: VFDXE5FXCRLZ · pith_short_16: VFDXE5FXCRLZ5VUT · pith_short_8: VFDXE5FX

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Verify this Pith Number yourself

curl -sH 'Accept: application/ld+json' https://pith.science/pith/VFDXE5FXCRLZ5VUT76G656MCMV \
  | jq -c '.canonical_record' \
  | python3 -c "import sys,json,hashlib; b=json.dumps(json.loads(sys.stdin.read()), sort_keys=True, separators=(',',':'), ensure_ascii=False).encode(); print(hashlib.sha256(b).hexdigest())"
# expect: a9477274b714579ed693ff8deef982657715cba9b96f5513331da07d5ce22ada

Canonical record JSON

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  "metadata": {
    "abstract_canon_sha256": "4df65c558c5c9d074b35f725f8b88d3c84fea27953f6313f70eaec1bd218cc0b",
    "cross_cats_sorted": [],
    "license": "http://creativecommons.org/licenses/by-sa/4.0/",
    "primary_cat": "physics.ins-det",
    "submitted_at": "2026-05-13T09:58:48Z",
    "title_canon_sha256": "3ab87c5893a6b5677fb75ce0f798c8a5becb44bb69c7ff985cb9fc915aa3d82f"
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    "kind": "arxiv",
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}