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arxiv: 1905.12761 · v1 · submitted 2019-04-26 · ⚛️ physics.class-ph · cond-mat.soft

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Anisotropic Two-Dimensional, Plane Strain, and Plane Stress Models in Classical Linear Elasticity and Bond-Based Peridynamics

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classification ⚛️ physics.class-ph cond-mat.soft
keywords planemodelsperidynamicclassicalelasticitylineartwo-dimensionalbond-based
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This paper concerns anisotropic two-dimensional and planar elasticity models within the frameworks of classical linear elasticity and the bond-based peridynamic theory of solid mechanics. We begin by reviewing corresponding models from the classical theory of linear elasticity. This review includes a new elementary and self-contained proof that there are exactly four material symmetry classes of the elasticity tensor in two dimensions. We also summarize classical plane strain and plane stress linear elastic models and explore their connections to the pure two-dimensional linear elastic model, relying on the definitions of the engineering constants. We then provide a novel formulation for pure two-dimensional anisotropic bond-based linear peridynamic models, which accommodates all four material symmetry classes. We further present innovative formulations for peridynamic plane strain and plane stress, which are obtained using direct analogies of the classical planar elasticity assumptions, and we specialize these formulations to a variety of material symmetry classes. The presented anisotropic peridynamic models are constrained by Cauchy's relations, which are an intrinsic property of bond-based peridynamic models. The uniqueness of the presented peridynamic plane strain and plane stress formulations in this work is that we directly reduce three-dimensional models to two-dimensional formulations, as opposed to matching two-dimensional peridynamic models to classical plane strain and plane stress formulations. This results in significant computational savings, while retaining the dynamics of the original three-dimensional bond-based peridynamic problems under suitable assumptions.

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